Both the thermal circuit calculation and the FEM simulation results indicated that the farther the temperature sensor was from the conductor, the more significant the error of the conductor-temperature calculation was. So, the factors influencing the conductor-temperature calculation errors were discussed below.
5.1. Effect of the Initial Temperature Difference on Errors
In Formula (6), the initial condition of each layer in the cable was assumed to be isothermal; however, the experimental conditions were different from this hypothesis. In particular, in Case 1, as shown in
Figure 7a, the initial temperatures of the jacket surface and the aluminum sheath were obviously higher than those of other three structures, the latter was of similar temperature. This caused remarkably larger initial errors that were based on Method 3 or Method 4 than those Methods 1 and 2, demonstrating in
Figure 9a. The influence of the obvious initial temperature difference Δ
T0 between the conductor and the boundary of the second-order resistance-capacitance circuit shown in
Figure 3 on the conductor temperature would decrease over time and the calculation errors would reduce. It also explained why the errors based on Methods 3 and 4 showed a decreasing tendency at the first several hours, and then increasing under the condition of the duct. When the cable was laid in water or backfilled soil, the temperature risings of the jacket surface and the aluminum sheath were gentle, so the influence of initial temperature on the calculation results was not significant. In these cases, the errors were mainly caused by the thermal resistivity inaccuracy. Placing the temperature sensor closer to the conductor, i.e., the insulation-shield and waterproof compound, would contribute to eliminating the effect of the non-isothermal initial temperature due to the environment.
5.2. Effect of the Thermal Resistivity on Errors
In this paper, the thermal resistivity from IEC standards, together with the parameters of quiescent air, were used in thermal circuit calculation. However, these values might be different from those calculated based on the measured temperatures. As is illustrated in
Figure 8, this difference made the temperature-calculation results higher or lower than the measurements overall. So, we used the steady-state temperatures of the tested cable shown in
Table 5 to calculate the thermal resistivities. The steady thermal circuit in
Figure 2 ensures that the heat storage of the thermal capacitances kept constant in the steady state, so the thermal capacitances were regarded as open-circuit type. The mean values of the calculated thermal resistivity are given in
Table 6.
As for the XLPE insulation, including the merged conductor shield and insulation shield, both the recommended and the calculated values were 3.5 (K·m)/W, which proved that the evaluation of the thermal resistivity of the insulation layer was precise. Homoplastically, for the thermal resistivity of the jacket, the recommended value was 3.5 (K·m)/W, while the calculated value was 3.3 (K·m)/W. To determine the influence of the thermal resistivity of the jacket, taking Case 1 as an example, the temperature of the aluminum sheath,
θal, was inverted from the temperature of the jacket surface based on the thermal circuit of Method 4, and a comparison of the calculated values was then made with those measured.
Figure 13 shows that the effect of the initial temperature decreased over time, and the calculation results of the aluminum sheath temperature was really close to those that were measured after 5.5 h. This means that the thermal resistivity of the jacket was acceptable, so in
Figure 9, the error curves based on Methods 3 and 4 exhibited a trend of moving toward each other.
It seems that the recommended thermal resistivities for the dense and solid materials, i.e., the XLPE insulation and jacket, were consistent with the calculated based on measured temperatures, while the others not. For the thermal resistivity of the waterproof compound, the IEC recommended value was 6 (K·m)/W, which was less than the calculated value of 12.1 (K·m)/W in this paper. It should be noted that the negative error in Method 2 increased after hour 2. Since only part of the thermal resistivity of the waterproof compound was involved due to the temperature sensor placed in the center of the waterproof compound, the errors of Method 2 were not so remarkable, even though the calculated thermal resistivity of the waterproof compound was twice that of the recommended.
As for the air gap between the waterproof compound and sheath, the recommended thermal resistivity was 34 (K·m)/W, which is almost three times the calculated value of 12.1 (K·m)/W. An overlarge recommended thermal resistivity of the air gap was the dominant reason for the significant calculation errors found in Methods 3 and 4, which would increase with increasing current.
Based on the calculated values of thermal resistivity, calculation errors of the transient and steady conductor-temperature for the four methods in each case were recounted, and then illustrated in
Figure 14.
For Method 1, the calculated insulation thermal resistivity was the same as the recommended, so the calculation errors were still small. Both the average errors and relative errors of Methods 2–4 in
Figure 14 sharply decreased to a very low level when compared to the results using the recommended thermal resistivity shown in
Figure 10 and
Figure 11. Their errors of transient and steady conductor temperature were less than 1.9 °C and 1.7 °C, respectively, apart from the higher values that were found in the first two cases with the initial-temperature differences caused by solar radiation.
The simulation results of the steady conductor temperature were also updated when using the calculated thermal resistance to describe the heat transfer of the air, i.e., Approach 2. The result is illustrated in
Table 7.
The simulation errors were less than 2.8 °C, apart from a higher value, 4.92 °C for Boundary 4 in Case 5. So, using the calculated thermal resistance, the FEM simulation results of Approach 2 were close to that of Method 1 as well as the measured results.
In summary, the thermal resistance of the air layer is the source of the largest error, so it seems that the temperature sensor should be placed closer to the conductor. Though the insulation-shield was the closest position to the conductor in this paper and led to the best accuracy, placing a temperature sensor in this position would have a potential risk of the direct contact with the insulation material. So, the waterproof compound was recommended for the better accuracy and good insulation security because the sensor was isolated from the insulation. Both the calculation and FEM simulation proved that when the uncertainty of thermal resistances, especially the air resistance was eliminated, the conductor temperature calculations using the temperatures of the waterproof compound or the aluminum sheath could obtain a close accuracy to that of insulation shield. The waterproof compound and the aluminum sheath, especially the latter, are more practical for engineering.
5.3. Effect of the Air Thermal Capacitance on Errors
From the point of dynamic response, the time constant of the circuit depends on its resistance and capacitance parameters. As shown in
Figure 14a, when thermal resistivities were calculated, the calculation errors of transient conductor temperature would not beyond 1.9 °C, apart from two higher values found in Method 4. So, the thermal capacitances were generally valid because the calculation accuracy was high enough. Since the IEC standard has provided the volumetric specific heat of solid material, we only analyzed the variation of the air thermal capacitance in this paper.
For an actual air layer, both the density and specific heat are temperature-varying. For example, they are 1.205 kg/m
3 and 1.005 kJ/(kg·K) at 20 °C, respectively, while 1.029 kg/m
3 and 1.009 kJ/(kg·K) at 70 °C. When taking the temperature-varying thermal capacitance into account, the calculation errors of transient conductor temperature were updated using Boundaries 3 and 4 by FEM. The results are presented in
Table 8.
In
Table 8, the results of using the constant and the temperature-varying air thermal capacitance were almost identical. The effect of the temperature-varying thermal capacitance of the air was so insignificant within the range of cable’s temperature variation that the errors caused by it could be neglected. Thus, defining the air thermal capacitance as a constant is appropriate. In other words, it is the thermal resistance, rather than the thermal capacitances, which is the main error source of temperature calculation.