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Journal: Materials, 2017
Volume: 10
Number: 137

Article: Electrochemical Migration Behavior of Copper-Clad Laminate and Electroless Nickel/Immersion Gold Printed Circuit Boards under Thin Electrolyte Layers
Authors: by Pan Yi, Kui Xiao, Kangkang Ding, Chaofang Dong and Xiaogang Li
Link: https://www.mdpi.com/1996-1944/10/2/137

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