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Journal: Materials, 2014
Volume: 7
Number: 4088

Article: An Optimal Cure Process to Minimize Residual Void and Optical Birefringence for a LED Silicone Encapsulant
Authors: by Min-Jae Song, Kwon-Hee Kim, Gil-Sang Yoon, Hyung-Pil Park and Heung-Kyu Kim
Link: https://www.mdpi.com/1996-1944/7/6/4088

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