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Editorial

Preface: International Conference on Recent Advances in Science and Engineering (RAiSE-2023) †

1
Department of Mechanical and Industrial Engineering, Manipal Institute of Technology, Manipal Academy of Higher Education, Manipal 576104, Karnataka, India
2
Department of Mechanical Engineering, School of Engineering and Information Technology, Manipal Academy of Higher Education, Dubai Campus, G04—Academic City, Dubai P.O. Box 345050, United Arab Emirates
*
Author to whom correspondence should be addressed.
All papers published in the volume are presented at the International Conference on Recent Advances in Science and Engineering, Dubai, United Arab Emirates, 4–5 October 2023.
Eng. Proc. 2023, 59(1), 240; https://doi.org/10.3390/engproc2023059240
Published: 15 March 2024
(This article belongs to the Proceedings of Eng. Proc., 2023, RAiSE-2023)

1. Introduction

The International Conference on Recent Advances in Science and Engineering, RAiSE-2023, organized by the Department of Mechanical & Industrial Engineering at Manipal Institute of Technology, MAHE, Manipal, India, in collaboration with the School of Engineering and IT at MAHE Dubai, UAE, on 4 and 5 October 2023 in hybrid mode at MAHE Dubai was a significant milestone in the scientific and engineering community. The event brought together distinguished guests, esteemed delegates, and leading researchers from various corners of the globe, fostering an atmosphere of knowledge exchange, collaboration, and innovation.
RAiSE-2023 emerged as a convergence point for brilliant minds, celebrating human ingenuity and the relentless pursuit of excellence within the dynamic fields of science and engineering. It provided a platform for delegates to explore uncharted territories, united by a shared quest for excellence. The conference’s theme of integration encouraged participants to transcend disciplinary boundaries and adopt a multi-disciplinary approach to scientific research and engineering innovation. RAiSE-2023 showcased the power of diverse perspectives coming together to drive progress. RAiSE-2023 marked a significant step towards internationalization, aligning with the Year of Internationalization by the Manipal Academy of Higher Education. The conference, held in Dubai in a hybrid mode, featured prestigious keynote speakers and recognized outstanding contributions with awards, emphasizing its role as a platform for advancing knowledge and disseminating groundbreaking research through partnerships with reputable journals. Collaborations with pioneering organizations reinforced the commitment to collective progress, making RAiSE-2023 a transformative event shaping the future of science and engineering.

2. The Conference

RAiSE 2023 invited abstracts and full papers pertaining to but not limited to various topics from academics, research scholars and industry practitioners, including the following:
  • Design Engineering;
  • Engineering Materials;
  • Energy Engineering;
  • Manufacturing Engineering;
  • Industrial Engineering;
  • Multi-Disciplinary Engineering.
This conference held particular significance as it aligned with the Year of Internationalization by the Manipal Academy of Higher Education. RAiSE-2023 in Dubai underscored its global outreach, with 260 delegates presenting online and 100 delegates presenting in person. Figure 1 shows the delegates present during the inauguration of the conference. The event truly became an international gathering, reflecting the widespread enthusiasm for advancing scientific research and engineering innovation. Over 12 countries, including the UAE, Saudi Arabia, Canada, Iraq, Iran, the United Kingdom, India, and more, were represented at the conference. With participation from more than 125 institutions and colleges, RAiSE-2023 became a global gathering of knowledge and expertise, showcasing the diverse perspectives driving scientific progress. Figure 2 shows the souvenir release in the inauguration program.
RAiSE-2023 featured a two-day hybrid mode conference comprising 14 offline sessions and 27 online sessions. The conference acknowledged the quality contributions of researchers through two distinct awards: the Best Paper award and the Best Researcher award, celebrating excellence and innovation in the field. The conference’s publication partnerships with eight reputable Scopus-indexed journals played a pivotal role in disseminating groundbreaking research to a global audience. These partnerships emphasized the significance of RAiSE-2023 as a platform for advancing knowledge and sharing research findings.
Renowned keynote speakers, including Dr. Jayant M Deshpande (Conscious Business Consultants, UAE), Prof. Dr. Subha A/P Bhassu (Professor, University of Malaya, Malaysia), Mr. Girin Pillai (Intel Corporation, Intel India) and Mr. Amit Vyas (Kalpar Castors, Kalpar Engineers Pvt. Ltd, India) enriched the conference with insights spanning conscious business practices, diverse scientific disciplines, and technology innovation, setting the stage for insightful discussions and visionary thinking. Collaborations with organizations at the forefront of cutting-edge technologies not only made RAiSE-2023 possible but also reinforced the importance of the collective mission to advance science and engineering. These partnerships enriched the conference and strengthened the commitment to progress.
In conclusion, RAiSE-2023 stands as a testament to the collaborative efforts of the global scientific and engineering community. The shared knowledge and innovations showcased at the conference are poised to inspire further progress in the realms of science and engineering worldwide. Figure 2 shows the valedictory program of the conference.

Author Contributions

All authors contributed equally to this paper. All authors have read and agreed to the published version of the manuscript.

Conflicts of Interest

The authors declare no conflicts of interest.
Figure 1. Delegates present during the inauguration of the RAiSE 2023.
Figure 1. Delegates present during the inauguration of the RAiSE 2023.
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Figure 2. Valedictory program of the RAiSE 2023.
Figure 2. Valedictory program of the RAiSE 2023.
Engproc 59 00240 g002
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MDPI and ACS Style

Hiremath, P.; Kowshik, S.; Bhat, R.; Selvam, R.; Naik, N. Preface: International Conference on Recent Advances in Science and Engineering (RAiSE-2023). Eng. Proc. 2023, 59, 240. https://doi.org/10.3390/engproc2023059240

AMA Style

Hiremath P, Kowshik S, Bhat R, Selvam R, Naik N. Preface: International Conference on Recent Advances in Science and Engineering (RAiSE-2023). Engineering Proceedings. 2023; 59(1):240. https://doi.org/10.3390/engproc2023059240

Chicago/Turabian Style

Hiremath, Pavan, Suhas Kowshik, Ritesh Bhat, Rajiv Selvam, and Nithesh Naik. 2023. "Preface: International Conference on Recent Advances in Science and Engineering (RAiSE-2023)" Engineering Proceedings 59, no. 1: 240. https://doi.org/10.3390/engproc2023059240

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