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Artificial Intelligence on the Edge for Industry 4.0

A special issue of Applied Sciences (ISSN 2076-3417). This special issue belongs to the section "Computing and Artificial Intelligence".

Deadline for manuscript submissions: 12 July 2025 | Viewed by 756

Special Issue Editors


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Guest Editor
Department of Informatics and Telecommunications, University of Ioannina, GR-47100 Arta, Greece
Interests: Industry 4.0; artificial intelligence computational intelligence, fuzzy cognitive maps; fuzzy logic, neural networks; support vector machines; knowledge-based systems; modeling complex systems; intelligent systems; medical decision support systems; biosignal processing and analysis; hierarchical systems and supervisory control; intelligent manufacturing systems
Special Issues, Collections and Topics in MDPI journals

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Guest Editor
Faculty of Mechanical Engineering and Aeronautics, Rzeszów University of Technology, 35-959 Rzeszów, Poland
Interests: production engineering; lean production; intelligent manufacturing systems; human–robot collaboration; sustainable development; human-centric manufacturing systems.
Special Issues, Collections and Topics in MDPI journals

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Guest Editor
Computer Science Department, University of Pisa, 56126 Pisa, PI, Italy
Interests: industrial IoT; embedded programming; industrial innovation; AI on the edge for industrial applications; human–machine and human–robot interaction
Special Issues, Collections and Topics in MDPI journals

Special Issue Information

Dear Colleagues,

This special issue is based on the conference "Industry 4.0 and Beyond - The Final Conference of the PLANET4 Project", which is planned for the 2nd October in Pisa, Italy, as the final event of the PLANET4 project. It will provide an excellent international forum for disseminating original research results, new ideas and practical development experiences concentrating on both the theory and practices of academics, researchers, engineers and industry professionals. It aims to bring together researchers and scientists from academia, industry and research centers to present the results of ongoing research, exchange ideas and identify future research directions in the following areas: Industry 4.0; data science, artificial intelligence and machine learning; internet of things and industrial internet of things; and cloud and edge computing.

Prof. Dr. Chrysostomos Stylios
Prof. Dr. Dorota Stadnicka
Dr. Joan Navarro
Dr. Daniele Mazzei
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Applied Sciences is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2400 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • Industry 4.0 and beyond
  • smart manufacturing and automation
  • digital twins
  • augmented and virtual reality
  • cybersecurity in Industry 4.0
  • blockchain technology
  • sustainable manufacturing
  • human-machine collaboration
  • additive manufacturing
  • Industry 4.0 and the digital transformation of manufacturing
  • collaborative robots (cobots)
  • education, innovation and change management in the industrial sector
  • data science
  • artificial intelligence and machine learning
  • deep learning
  • explainable AI and trustworthiness
  • computer vision
  • supply chain optimization
  • quality control and defect detection
  • energy management and optimization
  • robotics and automation
  • natural language processing for customer service
  • fraud detection and prevention
  • cybersecurity and threat detection
  • big data analytics for industry
  • optimization of industrial processes
  • precision agriculture
  • predictive maintenance Internet of Things and Industrial Internet of Things
  • smart cities and IoT
  • industrial automation and the IIoT
  • IoT-enabled smart homes
  • IoT and environmental monitoring
  • IoT and supply chain management
  • IoT and cybersecurity in industrial environments
  • IoT analytics and machine learning
  • 5G and the IoT
  • IoT and IIoT connectivity technologies and standards
  • IoT and IIoT interoperability and integration with legacy systems and protocols
  • cloud and edge computing
  • edge computing use cases and applications across different industries
  • cloud and edge security challenges and solutions
  • distributed systems and data management in the cloud and at the edge
  • edge computing hardware and software platforms and their integration with the cloud
  • cloud and edge performance and scalability challenges and solutions
  • edge computing architectures and their integration with cloud providers
  • edge computing and cloud computing interoperability and integration
  • edge computing and cloud computing for real-time and mission-critical applications
  • fog computing and its relationship to cloud and edge computing
  • edge computing for mobile and wireless networks

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Published Papers

This special issue is now open for submission.
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