Thermophysical Properties of Compounds
A special issue of Applied Sciences (ISSN 2076-3417). This special issue belongs to the section "Applied Physics General".
Deadline for manuscript submissions: closed (31 March 2021) | Viewed by 250
Special Issue Editor
Interests: indoor comfort; innovative building materials; thermal insulation materials; acoustic insulation materials
Special Issues, Collections and Topics in MDPI journals
Special Issue Information
Dear Colleagues,
The study of the thermophysical properties of compounds is an important branch of physics that involves all the sectors related to heat transfer. In recent years, thermophysical properties such as thermal conductivity, dynamic viscosity, and surface tension are getting more and more attention from scientists and researchers due to their importance in applications such as mechanical and electrical systems, chemical processes, medical devices, electronics, and energy systems. As regards the energy sector, great interest from the scientific community was generated by recent studies on solar thermal collectors, nanofluids, and heat transfer fluids of the new generation that, thanks to complex heat transfer mechanisms, promise to improve the overall efficiency of energy systems.
Thus, this Special Issue is dedicated to the collection of new data or novel research methods concerning the thermophysical properties of compounds, with the aim to improve the aforementioned applications. The main goal is to propose and suggest high-level theories and new methods to calculate thermophysical properties. These include new calculation techniques based on fundamental aspects of thermodynamic theory, such as equations of state or the principle of corresponding states. Recent calculation methods that rely on artificial intelligence to determine the thermophysical properties of compounds also represent an important topic of the Special Issue under discussion.
Dr. Mariano Pierantozzi
Guest Editor
Manuscript Submission Information
Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.
Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Applied Sciences is an international peer-reviewed open access semimonthly journal published by MDPI.
Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2400 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.
Keywords
- Thermophysical properties
- Thermal conductivity
- Dynamic viscosity
- Surface tension
- Nanofluids
- Artificial intelligence
- Experimental data
- Heat transfer
- Chemical processes
- Energy systems
