Computational Thermal Engineering
A special issue of Computation (ISSN 2079-3197). This special issue belongs to the section "Computational Engineering".
Deadline for manuscript submissions: closed (31 December 2022) | Viewed by 539
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Special Issue Editors
Interests: computational methods; combustion; fire; turbulence; multi-phase flows; environmental flow; fluid machinery; biofluid dynamics
Special Issues, Collections and Topics in MDPI journals
Interests: melting; microchannel; carbon dioxide; acids; periodic structures; parameter design; phase change materials; cooling
Special Issues, Collections and Topics in MDPI journals
Interests: advanced thermal power cycles; thermal management of data centers and power sources; 3D printing in thermal engineering; multiphase flows; thermoeconomics
Special Issues, Collections and Topics in MDPI journals
Interests: power engineering; thermodynamics; heat transfer; inverse heat transfer problems; steam boiler dynamics; thermal stresses
Special Issues, Collections and Topics in MDPI journals
Interests: nonlinear wave propagation; numerical methods; reaction–diffusion equations; chemically reacting flows; fluid dynamics; asymptotic techniques
Interests: inverse problems of heat conduction; measurement of heat flux and heat transfer coefficient; modelling of slagging and fouling processes of power boiler heating surfaces; dynamics of large steam boilers; numerical modelling of steam super-heaters in transient states; thermal stresses; monitoring of energy machinery and equipment including residual strength; heat exchangers; heat pumps; photovoltaic cells; renewable energy; renewable energy sources
Special Issues, Collections and Topics in MDPI journals
Special Issue Information
Dear Colleagues,
Thermal engineering is one of the basic engineering disciplines, with a very wide coverage. Today’s urgent requirements for the more efficient utilization of energy resources lend the discipline even more significance.
This Special Issue is dedicated to demonstrating recent advances in the development and application of computational methods for solving a broad spectrum of problems arising in thermal engineering. Although thermofluids occupy a central position in thermal engineering, original contributions on conduction or thermostructural problems are also welcome. Papers may report on original research, discuss methodological aspects, review the current state of the art, or offer perspectives on future prospects.
Specific methods and fields of applications include, but are not limited to, the following:
- Combustion devices and systems
- Cogeneration systems
- Cooling and refrigeration
- Electronic devices
- Energy storage devices
- Fuel cells
- Heat exchangers
- Heat pipes
- HVAC
- Power plant components
- Renewable energy technologies
- Solar systems
- Thermal management
- Thermal flow machinery
Prof. Dr. Ali Cemal Benim
Prof. Dr. Kamel Hooman
Dr. Barış Burak Kanbur
Prof. Dr. Paweł Oclon
Prof. Dr. Juan I. Ramos
Prof. Dr. Jan Taler
Guest Editors
Manuscript Submission Information
Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.
Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Computation is an international peer-reviewed open access monthly journal published by MDPI.
Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 1800 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.
Keywords
- thermal engineering
- fluid flow
- heat transfer
- computational methods
