Devices, Tools, and Methodologies for Embedded System Development in the 5.0 Industry Era

A special issue of Electronics (ISSN 2079-9292). This special issue belongs to the section "Computer Science & Engineering".

Deadline for manuscript submissions: 15 January 2025 | Viewed by 50

Special Issue Editors


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Guest Editor
Department of Computer Architecture and Technology, University of Seville, 41012 Seville, Spain
Interests: logic synthesis; digital design; embedded systems; hardware implementation of finite state machines; reconfigurable computing; FPGA; CAD for digital circuits and systems; optimization; fuzzy systems
Special Issues, Collections and Topics in MDPI journals

E-Mail Website
Guest Editor
Department of Computer Architecture and Technology, University of Seville, 41012 Seville, Spain
Interests: wireless communication; wireless sensor networks; embedded systems

E-Mail Website
Guest Editor
Institute of Metrology, Electronics and Computer Science, University of Zielona Góra, 65-417 Zielona Góra, Poland
Interests: logic synthesis; FSM design; FPGA; ASIC; embedded systems; CAD of VLSI-based digital systems
Special Issues, Collections and Topics in MDPI journals

Special Issue Information

Dear Colleagues,

Industry 5.0 complements and extends Industry 4.0. Industry 5.0 should not be understood as a chronological continuation or an alternative to the existing Industry 4.0 paradigm. Industry 5.0 broadens the focus of the foundations of the Industry 4.0 paradigm by looking beyond profitability and economic productivity, and integrating human well-being, resilience, and sustainability. In fact, workplaces need to become more inclusive, supply chains to become more resilient, and production to become more sustainable.

With the advent of this new revolution, characterized by unprecedented levels of connectivity and collaboration between humans and machines, the landscape of embedded system development is undergoing profound transformations. Integrating cyber-physical systems, artificial intelligence, and advanced manufacturing technologies requires innovative devices, tools, and methodologies to support the development of next-generation embedded systems in emerging application areas, such as smart grids, autonomous vehicles, e-health, robotics, or smart recycling.

This Special Issue aims to showcase the latest research and advancements in embedded system technologies that underpin the evolution of the 5.0 Industry landscape. Topics may include, but are not limited to, the following:

  1. Design space exploration techniques for implementing embedded systems;
  2. Advanced hardware architectures for embedded systems;
  3. Formal methods and techniques for the verification and simulation of embedded systems;
  4. Low-power design in embedded systems;
  5. Embedded system security;
  6. The design and implementation of IP cores for embedded systems;
  7. Methodologies and tools for embedded system design in FPGA devices.
  8. Hardware–software co-design: methods and CAD tools;
  9. Application-specific instruction-set processors;
  10. The development of System on Chips for smart industrial applications;
  11. Real-time operating systems and middleware for cyber-physical systems;
  12. Machine learning and deep learning techniques for intelligent embedded systems;
  13. Network architectures and communication protocols for smart industrial IoT applications;
  14. Software Defined Network (SDN) for embedded systems;
  15. Edge computing and device-level fog computing;
  16. Vehicle-to-everything (V2X) Embedded Systems;
  17. The integration of virtual reality and augmented reality technologies in embedded systems;
  18. Sensors and actuators for the 5.0 Industry Era;
  19. Practical applications of embedded systems in 5.0 Industry scenarios.

Prof. Dr. Raouf Senhadji-Navarro
Prof. Dr. María José Moron-Fernández
Prof. Dr. Alexander Barkalov
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Electronics is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2400 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • embedded systems
  • hardware-software co-design
  • cyber-physical systems
  • real-time embedded systems
  • embedded systems security
  • FPGA-based design of embedded systems
  • edge computing
  • device-level fog computing

Published Papers

This special issue is now open for submission.
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