Millimeter-Wave Integrated Circuits and Systems for 5G Applications, Volume II

A special issue of Electronics (ISSN 2079-9292). This special issue belongs to the section "Circuit and Signal Processing".

Deadline for manuscript submissions: closed (31 March 2023) | Viewed by 379

Special Issue Editors


E-Mail Website
Guest Editor
1. Engineering Product Development (EPD), Singapore University of Technology and Design, Singapore 487372, Singapore
2. School of Microelectronics, Tianjin University, Tianjin 300072, China
Interests: circuits and systems; low-power integrated circuit design; visible light communications; CMOS technology; RF/mm-wave integrated circuit design; VLSI/ULSI design; memory
Special Issues, Collections and Topics in MDPI journals

E-Mail Website
Guest Editor
School of Electrical and Data Engineering, University of Technology Sydney, Ultimo, NSW 2007, Australia
Interests: RFIC design

E-Mail Website
Guest Editor
Institute of VLSI Design, Zhejiang University, Hangzhou 310027, China
Interests: analogue IC design; RF IC design

E-Mail Website
Guest Editor
School of Electrical and Electronic Engineering, Nanyang Technological University, 50 Nanyang Avenue, Singapore 639798, Singapore
Interests: low power integrated circuits and devices; ultra-wideband and radar; photoacoustics and thermoacoustics; 3D imaging and display; artificial intelligence
Special Issues, Collections and Topics in MDPI journals

Special Issue Information

Dear Colleagues,

Due to the explosive growth of mobile devices and 5G connectivity, wireless transmission at data rates greater than one gigabit per second (Gbps) is becoming essential. As a result, the network infrastructure will be endowed with an unprecedented degree of intelligence, integrating with the environment and offering fast, secure, and reliable communications. Objects like lamp posts, road signs, buildings, vehicles, drones, robots, trains, and watercrafts will be equipped with intelligent devices able to detect electromagnetic signals, perform computations, and store data.

It is extremely challenging to achieve Gbps data rate applications below a 6 GHz band due to spectrum scarcity. Therefore, the millimeter-wave (MMW) band has drawn increasing interest over recent years for its potential to enable ultrahigh-speed wireless transmission. Combining cutting-edge network technology and MMW integrated circuit design, 5G technology offers connections that are multitudes faster than current connections with low latency (1 ms or less) and high speed (>1 Gbps) for massive Internet of Things (IoT), tactile internet, drones, and robotics. It will transform the way we live, play, work, and travel while delivering more performance, efficiency, and comfort. New products, systems, services, business models, and entire industries will be born as 5G technology provides a huge leap forward in speed, capacity, and connectivity.

The main aim of this Special Issue is to disseminate the latest findings, new research developments, and future trends and innovations in MMW integrated circuits and systems for 5G applications. Both theoretical and experimental studies for MMW IC design, architectures, technologies, devices, circuits, and systems are encouraged. Furthermore, high-quality review and survey papers are welcomed.

Regarding Volume I, please refer to the following link (https://www.mdpi.com/journal/electronics/special_issues/MMwave_circuit). All 11 published papers can be accessed freely.

The papers considered for possible publication may focus on but are not necessarily limited to the following areas:

  • MMW circuits, such as low-noise amplifiers, mixers, voltage-controlled oscillators, power amplifiers, variable gain amplifiers, etc.;
  • MMW architectures, systems and subsystems, such as receivers, transmitters, transceivers, phase-locked loops, frequency synthesizers, multistandard transceivers, digital radio, etc.;
  • MMW passive structures such as transformers, hybrid couplers, filters, baluns, switches, antennas, etc.;
  • MMW digital baseband; MMW data converters; wireless communication systems; wideband integrated circuits and systems; low-power and energy-efficient MMW digital systems;
  • Advanced MMW ICs; emerging MMW nanoscale CMOS ICs; MMW 3D integrations; MMW SiP and SOC.

Prof. Dr. Kiat Seng Yeo
Dr. Forest Xi Zhu
Prof. Dr. Xiaopeng Yu
Dr. Yuanjin Zheng
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Electronics is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2400 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • millimeter-wave circuits and systems
  • transceivers
  • low-power, energy-efficient MMW IC design
  • wireless communication systems
  • millimeter-wave digital baseband
  • advanced MMW IC technologies, SiP and SOC

Published Papers

There is no accepted submissions to this special issue at this moment.
Back to TopTop