-
Defamiliarization Attack: Literary Theory Enabled Discussion of LLM Safety -
Advances in Closed-Loop Artificial Intelligence for Healthcare -
Securing Unmanned Devices in Critical Infrastructure: A Survey of Hardware, Network, and Swarm Intelligence -
Model-Based Global Path Planning for Mobile Robots with Different Kinematic Structures Under Path Length and Energy Efficiency Criteria: A Case Study
Journal Description
Electronics
- Open Access— free for readers, with article processing charges (APC) paid by authors or their institutions.
- High Visibility: indexed within Scopus, SCIE (Web of Science), CAPlus / SciFinder, Inspec, Ei Compendex and other databases.
- Journal Rank: JCR - Q2 (Engineering, Electrical and Electronic) / CiteScore - Q1 (Electrical and Electronic Engineering)
- Rapid Publication: manuscripts are peer-reviewed and a first decision is provided to authors approximately 16.4 days after submission; acceptance to publication is undertaken in 2.6 days (median values for papers published in this journal in the second half of 2025).
- Recognition of Reviewers: reviewers who provide timely, thorough peer-review reports receive vouchers entitling them to a discount on the APC of their next publication in any MDPI journal, in appreciation of the work done.
- Companion journals for Electronics include: Magnetism, Microwave, Network, Signals, Software, Microelectronics, Semiconductors and Heterogeneous Integration and Analog.
- Journal Cluster of Electronic Engineering and Hardware Systems: Chips, Electronics, Hardware, Journal of Low Power Electronics and Applications, Microelectronics and Microwave.
Latest Articles
E-Mail Alert
News
Meet Us at the 3rd International Conference on AI Sensors and Transducers, 2–7 August 2026, Jeju, South Korea
Meet Us at the 17th IEEE International Conference on Electron Devices and Solid-State Circuits (EDSSC 2026), 9–12 June 2026, Guangzhou, China
Topics
Deadline: 20 May 2026
Deadline: 31 May 2026
Deadline: 30 June 2026
Deadline: 31 July 2026
Conferences
Special Issues
Deadline: 20 May 2026
Deadline: 20 May 2026
Deadline: 20 May 2026
Deadline: 20 May 2026















