Smart Sensors

A special issue of Instruments (ISSN 2410-390X).

Deadline for manuscript submissions: closed (30 June 2019) | Viewed by 290

Special Issue Editors

School of Engineering, University of British Columbia, Okanagan, Kelowna, BC V1V 1V7, Canada
Interests: intelligent sensing, measurement, and instrumentation; diagnostics, prognostics, and health management; predictive maintenance; digital twins; computational intelligence and data/information fusion; non-destructive testing and evaluation; machine/computer vision; data analytics and machine learning
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Guest Editor
Department of Electrical Engineering and Information, University of Cassino and Southern Lazio, Via G. Di Biasio, 43, Cassino, Italy
Interests: wireless sensor networks; instrument interfaces; digital signal processing for advanced instrumentation
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Guest Editor
Department DIIES, University Mediterranea of Reggio Calabria, Reggio Calabria, Italy
Interests: thermography; biomedical devices; measurement uncertainty; instrumentation; decision making
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Special Issue Information

Dear Colleagues,

In recent years, there has been an increasing demand for smart sensors, which are fabricated with piezoceramics, fibre Bragg grating (FBG), polyvinylidene fluoride (PVDF), etc. Meanwhile, the conventional and widely used sensors, such as thermal couples, pressure transducers, magnetic sensors, etc., are becoming more intelligent by integrating a micro-control unit, which makes them autonomous sensors. Moreover, an increasing number of smart sensors that are enabled by various nanotechnologies, such as those based on shape-memory alloys or polymers, magnetostrictive materials, etc., could be used not only in military or space applications but also in various industrial and consumer applications.

Up to now, there are numerous new classes of smart sensors, which are often integrated with various measurement architectures, possessing the ability to sense and respond to structural or environmental changes in an autonomous way. With the development of sensor networks, it will be possible to utilize the smart sensors in more and more applications, such as structural health monitoring in aerospace engineering, geophysical engineering, civil engineering, mechanical engineering, etc.

The objective of this Special Issue is to highlight recent new developments and methodologies in smart sensors, autonomous measurement architectures, and the corresponding applications, as well as the prospects and challenges of this field.

We welcome submissions on a wide range of topics that include, but are not limited to:

  • Piezoceramic transducers and applications
  • Fiber optic sensors, including fibre Bragg grating, and applications
  • Polyvinylidene fluoride sensors and applications
  • Magnetic sensors for weak magnetic detection
  • Structural health monitoring: damage detection, localization, and quantification
  • Smart techniques for non-destructive measurements
  • Smart sensors and sensor network
  • Shape-memory alloys and applications
  • Shape-memory polymers and applications
  • Smart composite materials and smart composite structures
  • The exploitation of complexity in sensors, MEMS, and NEMS
  • Computational methodologies and fusion algorithms for sensor applications

Dr. Zheng Liu
Dr. Vincenzo Paciello
Dr. Rosario Morello
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Instruments is an international peer-reviewed open access quarterly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 1400 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Published Papers

There is no accepted submissions to this special issue at this moment.
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