Advances in Dissimilar Metal Joining and Welding

Special Issue Editors


E-Mail Website
Guest Editor
Institute of Science and Innovation in Mechanical and Industrial Engineering (INEGI), University of Porto, 4200-465 Porto, Portugal
Interests: dissimilar joining; structural integrity; friction stir welding; fatigue; fracture

E-Mail Website
Guest Editor
Department of Mechanical Engineering, University of Aveiro, 3810-193 Aveiro, Portugal
Interests: structural integrity; computational mechanics; fracture mechanics; fatigue; digital-twins

Special Issue Information

Dear Colleagues,

Dissimilar material welding holds immense relevance in contemporary manufacturing due to its pivotal role in integrating diverse materials to meet specific engineering requirements. As industries increasingly demand lighter, stronger, and more versatile components, dissimilar material welding facilitates the construction of advanced structures and assemblies. However, it poses unique challenges stemming from the inherent differences in physical properties, thermal expansion coefficients, and metallurgical behaviors among dissimilar materials. Achieving robust welds while minimizing distortion, residual stresses, and intermetallic compound formation remains a daunting task. Moreover, ensuring the long-term structural integrity and reliability of dissimilar weld joints under varying operating conditions further compounds the challenges. Addressing these complexities requires interdisciplinary research efforts, innovative welding techniques, and a comprehensive understanding of material science and engineering principles, highlighting the significance of ongoing exploration and advancements in this field.

The Journal of Manufacturing and Materials Processing presents a Special Issue focused on dissimilar metal joining and welding. This Special Issue examines the latest advancements and practical implications in joining different metals, metal polymer joints, and metal composite joints, crucial across industries like the automotive, aerospace, and electronics industries.

Aligned with the journal's scope, this Special Issue addresses the fundamental challenges and innovative solutions in manufacturing processes and materials engineering. Contributors explore diverse methods, including friction stir welding, laser welding, ultrasonic welding, and adhesive bonding, tackling issues such as metallurgical compatibility, thermal management, and joint integrity.

Through experimental manufacturing trials, material and joint mechanical characterization, numerical modeling, and advanced experimental characterization of dissimilar joints and structures, this Special Issue fosters scientific discourse and practical insights essential for developing efficient and sustainable dissimilar metal joining techniques. It serves as a platform to bridge theoretical understanding with real-world applications, facilitating the advancement of manufacturing technologies and materials science.

Dr. Daniel F.O. Braga
Dr. Sérgio Tavares
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Journal of Manufacturing and Materials Processing is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 1800 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • dissimilar joining
  • welding
  • intermetallics
  • bonding mechanisms
  • structural integrity
  • fatigue
  • fracture
  • corrosion

Benefits of Publishing in a Special Issue

  • Ease of navigation: Grouping papers by topic helps scholars navigate broad scope journals more efficiently.
  • Greater discoverability: Special Issues support the reach and impact of scientific research. Articles in Special Issues are more discoverable and cited more frequently.
  • Expansion of research network: Special Issues facilitate connections among authors, fostering scientific collaborations.
  • External promotion: Articles in Special Issues are often promoted through the journal's social media, increasing their visibility.
  • e-Book format: Special Issues with more than 10 articles can be published as dedicated e-books, ensuring wide and rapid dissemination.

Further information on MDPI's Special Issue polices can be found here.

Published Papers (2 papers)

Order results
Result details
Select all
Export citation of selected articles as:

Research

18 pages, 12668 KiB  
Article
The Mechanical Properties of a Transient Liquid Phase Diffusion Bonded SSM-ADC12 Aluminum Alloy with a ZnAl4Cu3 Zinc Alloy Interlayer
by Chaiyoot Meengam, Yongyuth Dunyakul and Dech Maunkhaw
J. Manuf. Mater. Process. 2024, 8(5), 184; https://doi.org/10.3390/jmmp8050184 - 23 Aug 2024
Viewed by 709
Abstract
In this study, the mechanical properties of SSM-ADC12 aluminum alloy specimens with a ZnAl4Cu3 zinc alloy interlayer were observed after Transient Liquid Phase Diffusion Bonding (TLPDB), a welding process conducted in a semi-solid state. The purpose of the experiment was to study how [...] Read more.
In this study, the mechanical properties of SSM-ADC12 aluminum alloy specimens with a ZnAl4Cu3 zinc alloy interlayer were observed after Transient Liquid Phase Diffusion Bonding (TLPDB), a welding process conducted in a semi-solid state. The purpose of the experiment was to study how the following parameters—bonding temperature (400, 430, 460, 490, and 520 °C), bonding time (60, 90, and 120 min), and thickness of the ZnAl4Cu3 zinc alloy (0.5, 1.0, and 2.0 mm)—affect the mechanical properties and the types of defects that formed. The results show that the bonding strength varied significantly with different parameters following the TLPDB process. A maximum bonding strength of 32.21 MPa was achieved at a bonding temperature of 490 °C, with 20 min of bonding and a ZnAl4Cu3 zinc alloy layer that was 2.0 mm thick. Conversely, changing the welding parameters influenced the bonding strength. A minimum bonding strength of 2.73 MPa was achieved at a bonding temperature of 400 °C, with a bonding time of 90 min and a ZnAl4Cu3 zinc alloy interlayer that was 2.0 mm thick. The Vickers microhardness results showed that the bonded zone had a lower hardness value compared to the base materials (BMs) of the SSM-ADC12 aluminum alloy (86.60 HV) and the ZnAl4Cu3 zinc alloy (129.37 HV). The maximum hardness was 83.27 HV, which resulted from a bonding temperature of 520 °C, a bonding time of 90 min, and a ZnAl4Cu3 zinc alloy that was 2.0 mm thick. However, in the near interface, the hardness value increased because of the formation of MgZn2 intermetallic compounds (IMCs). The fatigue results showed that the stress amplitude was 31.21 MPa in the BMs of the SSM-ADC12 aluminum alloy and 20.92 MPa in the material that results from this TLPDB process (TLPDB Material) when the limit of cyclic loading exceeded 106 cycles. Microstructural examination revealed that transformation from a β-eutectic Si IMC recrystallization structure to η(Zn–Al–Cu) and β(Al2Mg3Zn3) IMCs occurred. A size reduction to a width of 6–11 µm and a length of 16–44 µm was observed via SEM. Finally, voids or porosity and bucking defects were found in this experiment. Full article
(This article belongs to the Special Issue Advances in Dissimilar Metal Joining and Welding)
Show Figures

Figure 1

15 pages, 5968 KiB  
Article
High-Precision Integration of Optical Sensors into Metallic Tubes Using Rotary Swaging: Process Phenomena in Joint Formation
by Nassr Al-Baradoni, Philipp Heck and Peter Groche
J. Manuf. Mater. Process. 2024, 8(2), 60; https://doi.org/10.3390/jmmp8020060 - 15 Mar 2024
Viewed by 1620
Abstract
A novel process design for the damage-free and highly accurate positional integration of an optical multi-axial force sensor into a hollow tube by means of rotary swaging is introduced. Numerical simulations reveal the relevant process phenomena of thin disc joining inside a pre-toothed [...] Read more.
A novel process design for the damage-free and highly accurate positional integration of an optical multi-axial force sensor into a hollow tube by means of rotary swaging is introduced. Numerical simulations reveal the relevant process phenomena of thin disc joining inside a pre-toothed hollow tube and help us to find an optimal process design. Experimental trials show the significant effect of the axial material flow and the number of tools on the rotary swaging process. By taking these effects into account, successful form- and force-fit joining of the sensor carrying discs into the tube can be achieved. Successful joining of an optical sensor for bending force and torque measurement shows hysteresis-free sensory behavior and thus backlash-free joining of the sensor carrier discs. The paper concludes with a presentation of the results of a numerical study on a potential closed-loop approach to the joining process. Full article
(This article belongs to the Special Issue Advances in Dissimilar Metal Joining and Welding)
Show Figures

Figure 1

Back to TopTop