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Advances in Electronic Films: Preparation, Characterization, and Applications

A special issue of Materials (ISSN 1996-1944). This special issue belongs to the section "Thin Films and Interfaces".

Deadline for manuscript submissions: 20 October 2024 | Viewed by 70

Special Issue Editors


E-Mail Website
Guest Editor
Polish Academy of Sciences, Institute of Physics, al. Lotników 32/46, 02-668 Warszawa, Poland
Interests: solid state physics; metal–oxide–semiconductor; atomic layer deposition; thin films; X-ray powder diffraction
Special Issues, Collections and Topics in MDPI journals

E-Mail Website
Guest Editor
Polish Academy of Sciences, Institute of Physics, al. Lotników 32/46, 02-668 Warszawa, Poland
Interests: solid state physics; atomic layer deposition; thin films; dielectrics; high-k materials; semiconductors; antibacterial layers; atomic force microscopy; spintronics; electronics; photovoltaics
Special Issues, Collections and Topics in MDPI journals

Special Issue Information

Dear Colleagues

In this Special Issue, we encourage submissions of all articles discussing the preparation, characterization, and application of thin films for use in advanced electronics.

Thin films, nanomaterials, nanotubes, etc. play crucial roles in modern technology, forming the foundation for electronic devices, ranging from transistors and solar cells to touchscreens and flexible electronics. As research in this field progresses, advancements are continuously being made in the preparation, characterization, and application of these films. For the preparation of these devices, scientists are exploring novel methods for depositing thin films, such as atomic layer deposition (ALD), pulsed laser deposition (PLD), molecular beam epitaxy (MBE), and solution-based processing.

As advancements in electronic films are driven by continuous research and development in their preparation, characterization, and application and these advancements lead to the development of innovative and high-performance devices that will have a significant impact on various sectors in the future, we invite you to submit your manuscripts to this Special Issue. Full papers, communications, and reviews are all welcome.

Dr. Lukasz Wachnicki
Dr. Sylwia Gierałtowska
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Materials is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • 2D and 3D nanomaterials
  • wide bandgap semiconductor
  • electronic, photonic, and spintronic applications
  • nanocomposite materials—synthesis and characterization
  • growth method—ALD, CVD, PVD, MBE, etc.

Published Papers

This special issue is now open for submission.
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