Recent Advances in Flexible Thermoelectric Films and Devices

Dear Colleagues,

It is my pleasure to invite you to submit full papers, communications, and reviews to the forthcoming Special Issue “Recent Advances in Flexible Thermoelectric Films and Devices”.

In the pursuit of sustainability and eco-safety, the share of renewables has been constantly increasing in the energy domain for decades. By providing an elegant and versatile way to convert virtually any heat source to electrical power and vice versa, thermoelectric technology has rightfully gained significant interest from researchers and industries in this area. Simple in design and easily scalable, the thermoelectric energy converters (TEC) are suitable for a variety of applications ranging from low-watt personal electronics to energy-hungry heavy industries. The practical integrability and availability of TECs for these, particularly in low-power applications, have been improved even further improved by the emergence of flexible thermoelectrics.              

Within the latter context, this Special Issue of MDPI’s Materials journal aims to provide a forum for academics and those in the industry to share their recent advances in this field, with emphasis on flexible thermoelectric devices for—but not limited to—energy applications. Manuscripts dedicated to the research and development of flexible and thin-film thermoelectric materials, devices for power generation or cooling as well as metrological applications are welcome. Papers on the materials science of flexible and film thermoelectrics, practical implementation of these materials and devices on their basis, theoretical works, computational simulations of flexible TECs, methods for heat/electricity delivery to flexible thermoelectric converters (electrodes, thermoelectric interfaces, heat exchangers, etc.), processing and integration technologies, extending potential applications, economical aspects of the market of thermoelectrics, and review papers are also encouraged.

I look forward to your contributions.

Prof. Dr. Marie-Christine Record
Guest Editor

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Materials is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

• thin film thermoelectrics
• flexible thermoelectrics
• fiber thermoelectrics
• thermoelectric textiles
• thermoelectric converters/generators/coolers
• wearable thermoelectrics
• micro-/nano-thermoelectrics
• heat exchangers
• thermoelectric interfaces
• computational simulations
• processing and integration
• market assessment