Thermal Reliability of Advanced Materials and Structures

Dear Colleagues,

Advanced materials with various functionalities or structural features have been increasingly utilized in recent years to meet the sophisticated demands of modern technology. These materials encompass soft materials, functionally graded materials, quasicrystals, and smart materials and structures. Thermal failure presents a significant concern for many advanced materials and structures across diverse thermal environments. Examples include space exploration devices operating in extreme temperatures, high-energy laser manufacturing of microelectronic devices, combustion chambers in jet engines, overheating of electronic devices during service cycles, and thermal fatigue of solar panels, among others. Gaining a deeper understanding of thermal failure mechanisms is crucial for designing reliable advanced materials and structures.

This Special Issue is dedicated to exploring the thermal reliability of advanced materials and structures under various thermal disturbances. Topics range from transient heating in ultrafast laser fabrication to the quenching of advanced metal alloys, thermal cycles in electronic devices, and transient heat conduction in heterogeneous microstructures. We welcome papers that address heat conduction, thermal stress analysis, thermal fatigue and fracture of advanced materials and structures, and related subjects. By showcasing recent advancements in this critical area, we aim to enhance our understanding of the thermal reliability of advanced materials and structures.

Prof. Dr. Zengtao Chen
Prof. Dr. Keqiang Hu
Prof. Dr. Wenzhi Yang
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Materials is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

• heat conduction
• thermal impact
• thermal stress analysis
• advanced materials and structures
• fatigue and fracture
• thermal barriers