State-of-the-Art Models for Describing Microstructure Evolution and Fatigue Prediction in Multicomponent Metallic Alloys

A special issue of Metals (ISSN 2075-4701). This special issue belongs to the section "Metal Failure Analysis".

Deadline for manuscript submissions: 30 September 2024 | Viewed by 1170

Special Issue Editor


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Guest Editor
Faculty of Mechanical Engineering, Silesian University of Technology, Konarskiego 18A, 44-100 Gliwice, Poland
Interests: finite element method; laser-material interaction; data-driven materials science; artificial neural network; Pb-free solder alloys; intermetallic compounds; multi-principal element alloys; dynamics at materials interface; multiphysics simulation; heat transfer; transport phenomena at mesoscale; in situ imaging techniques
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Special Issue Information

Dear Colleagues,

Metallic alloys are predominantly utilized in the industrial sectors. In order to achieve a desirable combination of properties, multicomponent alloys have been explored for technological applications. The microstructural evolution of alloys during processing and service has a significant role on determining the overall performance of the materials. As metallic materials in practical applications are subjected to cyclic loading, their fatigue resistance is a highlighted topic.

Experimental data are inevitably needed to understand the behavior of metallic materials. Computational models, on the other hand, are very useful for describing the mechanisms associated with the microstructural evolution of these materials. For a multicomponent alloy system, it is necessary to address the composition dependence of the material properties using computational models. Statistical data and multiscale models can make it easier to predict the fatigue behavior of metallic alloys when subjected to periodic loads. The numerical quantification of fatigue-based damage accumulation, failures, and crack growth will enable the design of highly reliable devices. This Special Issue is aimed at recent advances in experimental data, computational models, and statistical models that are utilized to describe the microstructural evolution and fatigue behavior of multicomponent metallic alloys. Of particular interest are the insights into microstructure-based fatigue life models for multicomponent metallic alloys

Dr. Anil Kunwar
Guest Editor

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Keywords

  • multicomponent metallic alloys
  • microstructural evolution
  • grain growth
  • phase field method
  • fatigue behavior
  • damage accumulation
  • crack growth
  • statistical models
  • micromechanical fatigue experiments
  • microscopy

Published Papers (1 paper)

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Research

15 pages, 5942 KiB  
Article
In Situ Study the Grooving Effect Induced by Ag Particles on Rapid Growth of Cu6Sn5 Grain at Sn-xAg/Cu Soldering Interface during the Heat Preservation Stage
by Bingfeng Guo, Haitao Ma, Anil Kunwar, Rongzhi Wang and Han Zheng
Metals 2023, 13(8), 1445; https://doi.org/10.3390/met13081445 - 11 Aug 2023
Cited by 1 | Viewed by 797
Abstract
Synchrotron radiation X-ray imaging technique was applied for in situ observation of Cu6Sn5 intermetallic compounds (IMC) growth in Sn/Cu and Sn-3.5Ag/Cu joints under isothermal temperature conditions of 250/300/350 °C and time duration of 1.5 h. The IMC in Sn-Ag solder [...] Read more.
Synchrotron radiation X-ray imaging technique was applied for in situ observation of Cu6Sn5 intermetallic compounds (IMC) growth in Sn/Cu and Sn-3.5Ag/Cu joints under isothermal temperature conditions of 250/300/350 °C and time duration of 1.5 h. The IMC in Sn-Ag solder was characterized by the formation of grooves during the interfacial reaction, and this can be attributed to the Ag content. Kinetically, the growth rate constants for the height of Cu6Sn5 were observed to increase with temperatures and the presence of Ag in solder. As compared to pure Sn solders, the Sn-3.5Ag solders were observed with interfacial IMC of greater height, smaller base width, and lowered aspect ratio. Full article
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