Computational Modeling and Numerical Simulation of Additive Manufacturing Processes

A special issue of Metals (ISSN 2075-4701). This special issue belongs to the section "Additive Manufacturing".

Deadline for manuscript submissions: closed (31 December 2020) | Viewed by 5803

Special Issue Editor


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Department of Civil and Environmental Engineering, Technical University of Catalonia, UPC BarcelonaTech, 08034 Barcelona, Spain
Interests: computational mechanics; computational plasticity; contact mechanics; coupled thermomechanical problems; finite element method
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Special Issue Information

Dear Colleagues,

Additive manufacturing (AM), also known as 3D-printing, is a rapidly emerging manufacturing technology which, in the past few years, has evolved into one of the most promising techniques for creating solid structures of virtually any shape, based on digital models. AM is thought to be the next technological revolution.

In recent years, powered by the growing interest in this and related issues and motivated by the need to get high-quality final products and to reduce manufacturing costs, a number of research efforts have been made in the numerical simulation of AM processes. Despite the enormous progress, the large-scale numerical simulation of these problems continues to be a complex task, and its application in everyday production is still limited by several factors. Unaffordable computational times and lack of specialized analysts are usually claimed as the main reasons, but also distrust in reliability and/or output accuracy plays an important role. Indeed, the inner complexity of the process, characterized by high deformations, heat exchange phenomena, and the highly nonlinear nature of the problem evidence the scientific interest in this particular field of applied computational mechanics. The challenges AM poses on numerical simulation arise from its multiphysics and multiscale nature.

This Special Issue (SI) on “Computational Modeling and Numerical Simulation of Additive Manufacturing Processes” intends to collect the last developments in the field, written by well-known researchers who have contributed significantly in computational modeling, numerical simulation, mathematical formulation, or material characterization of AM processes.

Topics addressed in this SI may include but are not limited to:

  • Computational modeling and numerical simulation of AM processes;
  • Numerical methods for AM processes;
  • Thermomechanical formulation of AM processes;
  • Material characterization of AM processes;
  • Metallurgical characterization of AM processes;
  • Industrial applications of AM processes.

Prof. Carlos Agelet de Saracibar
Guest Editor

Manuscript Submission Information

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Keywords

  • additive manufacturing (AM)
  • 3D printing (3DP)
  • computational modeling
  • numerical simulation
  • finite elements
  • enhanced-accuracy
  • embedded domain methods
  • high-accuracy multi-level hp-adaptive finite cell method
  • multi-scale reduced order models
  • metallurgical characterization

Published Papers (2 papers)

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Research

14 pages, 3712 KiB  
Article
Thermal Boundary Evolution of Molten Pool During Wire and Arc Additive Manufacturing of Single Walls of 5A06 Aluminum Alloy
by Haibin Geng, Jian Luo, Jinglong Li, Jianjun Gao and Xin Lin
Metals 2020, 10(7), 848; https://doi.org/10.3390/met10070848 - 27 Jun 2020
Cited by 4 | Viewed by 2106
Abstract
Molten pool uniformity is a prerequisite for wire and arc additive manufacture to achieve a uniform surface appearance. The thermal boundary is a key indicator to evaluate the thermodynamic state of the molten pool. This paper focuses on thermal analysis through finite element [...] Read more.
Molten pool uniformity is a prerequisite for wire and arc additive manufacture to achieve a uniform surface appearance. The thermal boundary is a key indicator to evaluate the thermodynamic state of the molten pool. This paper focuses on thermal analysis through finite element simulation and characterizes the thermal evolution of a molten pool during bottom-up deposition. The peak temperature of the substrate plate increases from 375.7 °C to 623.1 °C when peak current increases from 120 A to 180 A. The temperature gradient decreases from 40 °C/mm to 30 °C/mm. Weld speed increases from 0.15 m/min to 0.25 m/min; the temperature gradient is kept at about 30 °C/mm. Dimensionless thermal conductivity, Ge number, is proposed and defined as the criteria to estimate layer size variation. For Ip = 140 A, the average value of the Ge number is 87.7, and it shows the best numerical stability. Dimensionless thermal conductivity, Ge, is proposed and defined as the criteria to estimate the occurrence of layer size variation. Prolonging heating time and increasing cycle frequency, Ge number shows favorable stability during bottom-up deposition. The experimental results are consistent with analytical conclusions, which proves the validity of the Ge number as an indicator of deposition stability. Full article
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11 pages, 1547 KiB  
Article
Theoretical Model of Residual Stress and Warpage for Wire and Arc Additive Manufacturing Stiffened Panels
by Haibin Geng, Jinglong Li, Jianjun Gao and Xin Lin
Metals 2020, 10(5), 666; https://doi.org/10.3390/met10050666 - 20 May 2020
Cited by 6 | Viewed by 2696
Abstract
Wire and arc additive manufacturing of stiffened ribs for fabricating large integral panel components holds promise for lightweight construction, but stress and warpage remain intractable problems. This work take stress in central lines as a research focus, theoretically analyzes stress evolution along central [...] Read more.
Wire and arc additive manufacturing of stiffened ribs for fabricating large integral panel components holds promise for lightweight construction, but stress and warpage remain intractable problems. This work take stress in central lines as a research focus, theoretically analyzes stress evolution along central lines without a stress distribution hypothesis, then further develops prediction models of warpage, based on general beam theory. The stress and warpage models are then verified by experimental results. The results showed that below 40 layers, the stress in the top layer increased rapidly to the yield strength. Following the continuous deposition of up to 100 layers, stress increased slowly, then gradually trended to a constant level. After 100 layers of deposition, the top-layer-plane stress in the 10th layer decreased from 68 MPa to 5 MPa, and the plane stress in the 90th layer decreased from 296 MPa to 245 MPa. Post-heating treatment effect was important for temperature uniformity. The largest warpage (3.48 mm) happened when stiffener was designed as 30 layers. Full article
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