Advances in Intelligent Sensors and IoT Solutions
A special issue of Sensors (ISSN 1424-8220). This special issue belongs to the section "Internet of Things".
Deadline for manuscript submissions: 31 August 2024 | Viewed by 9475
Special Issue Editors
Interests: building thermal monitoring; Internet of Things; intelligent sensors; wireless sensor network; cloud computing
Special Issue Information
Dear Colleagues,
The rapid advancement of technology has led to the emergence of sensors and the Internet of Things (IoT) as key components in diverse fields of monitoring. Sensors are devices that can perceive and measure physical, structural, environmental, chemical, or biological phenomena, while the IoT refers to the network of interconnected devices capable of collecting and exchanging data. The integration of sensors and the IoT has revolutionized industries such as healthcare, agriculture, transportation, construction, and smart cities through real-time data collection, monitoring, and postprocessing of monitoring data, which allows for improved decision-making, automation, and efficiency. While the integration of these two technologies offers numerous advantages, it also poses challenges. These include ensuring data security and privacy, managing the vast amount of generated data, interoperability issues, and power constraints for IoT devices. This Special Issue focuses on the theme of sensors and IoT and brings together a collection of research articles that explore the latest advancements, applications, and challenges in this dynamic field. The topics of interest include, but are not limited to, a review of IoT and intelligent sensors, advancements in the battery life and security of IoT solutions, cost efficiency, interoperability of IoT solutions with each other, and real-time postprocessing.
Dr. Behnam Mobaraki
Prof. Dr. Jose Turmo
Guest Editors
Manuscript Submission Information
Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.
Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Sensors is an international peer-reviewed open access semimonthly journal published by MDPI.
Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.
Keywords
- intelligent sensors
- IoT
- real time monitoring
- fog computing
- edge computing
- cloud computing
- smart cities
- smart grid
- battery life
- construction
- literature review
- wireless sensor network
- low-cost sensors
Planned Papers
The below list represents only planned manuscripts. Some of these manuscripts have not been received by the Editorial Office yet. Papers submitted to MDPI journals are subject to peer-review.
Title: Insulator Defect Detection Algorithm Based on Multi-Scale Detection Transformer
Author: Zou
Highlights: 1. To alleviate the confusion between the foreground and background, we introduce a context-based attention module to fully learn the relationship between defects and their backgrounds.
2. We introduce the insulators defect IDIoU loss to optimize the instability issues caused by small defects in the matching process, thereby accelerating training speed.