Advances on Structural Electronic Sensor Devices
A special issue of Sensors (ISSN 1424-8220). This special issue belongs to the section "Electronic Sensors".
Deadline for manuscript submissions: closed (1 May 2024) | Viewed by 1261
Special Issue Editor
Interests: stretchable electronics technologies
Special Issues, Collections and Topics in MDPI journals
Special Issue Information
Dear Colleagues,
Recently, we have seen growing interest in the potential use of Components of Electronic Sensor Devices for Structural Electronics. This Special Issue covers research on in-mold electronics, structural electronics, 3D-MID, etc.—technologies to create 3D surfaces/objects with integrated electronic functionality (sensors, actuators, antennas). As an important part of electronic engineering, integrated electronic technology has become an important support for the development of modern science and technology. In recent years, integrated electronic technology is also constantly improving, with some new achievements gaining significant attention.
This Special Issue aims to collate original research and review articles on the recent advances, technologies, solutions, applications, and new challenges in the deployment of electronic sensors. This includes areas such as design, modeling, technology and manufacturing, characterization, reliability testing and failure analysis, and scrapping strategies.
Papers need to be of relevant novelty but are not limited to integration in automotive interiors, wearables, human–machine interfaces, 3D antennas, lighting, etc.
Dr. Frederik Bossuyt
Guest Editor
Manuscript Submission Information
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Keywords
- stretchable electronics technologies
- wearable medical devices
- structural electronics