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Integrated Circuits and Technologies for Real-Time Sensing

A special issue of Sensors (ISSN 1424-8220). This special issue belongs to the section "Physical Sensors".

Deadline for manuscript submissions: closed (31 October 2023) | Viewed by 16880
Please contact the Guest Editor or the Section Managing Editor at ([email protected]) for any queries.

Special Issue Editors


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Guest Editor
Department of Computer Science, Modeling, Electronics and Systems Engineering (DIMES), University of Calabria, 87036 Rende, Italy
Interests: ultralow-power CMOS digital; mixed-signal circuits; modeling and design methodologies for leakage- and variability-aware circuits; arithmetic circuits
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Guest Editor
Institut Supérieur Electronique de Paris (Isep), LISITE, 10 rue de Vanves, 92130 Issy-les-Moulineaux, France
Interests: high-k metal gate planar; FDSOI; FinFET and TFET CMOS devices (mobility and reliability); GaN-on-Si device (HEMT and SBD); RERAM modeling; SRAM-based MTJ; TFET and FinFET technology; harvester energy system (RFEH); visual recognition algorithm implemented in FPGA; ASIP design; analog design (ultra-low power OTA and RF-DC converter)

Special Issue Information

Dear Colleagues,

At present, there is a growing demand for integrated circuits and technologies for real-time on-chip sensing in many application fields, ranging from automotive to medicine, from consumer to industrial, and from telecom to energy. Because initial integration attempts through system-on-package suffer from long wires and high RC delay, the current trend consists of integrating sensors (e.g., MEMS) through monolithic 3D integration and/or hetero integration with CMOS circuitry. Thus, the processing of sensor signals can be performed quickly and energy-efficiently, opening door to on-chip sensor nodes and enabling new concepts such as the Internet of Everything (IoE).

The aim of this Special Issue is to gather original contributions or review papers from researchers who are actively engaged in developing new solutions in any area of integrated sensors technologically compatible with CMOS processes.

Prof. Dr. Marco Lanuzza
Prof. Lionel Trojman
Guest Editors

Manuscript Submission Information

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Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Sensors is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • Smart sensors
  • Integrated sensing technologies
  • Magnetic sensors
  • Sensors design
  • Integrated sensors and transducers
  • CMOS
  • N/MEMS
  • Physical sensors
  • Chemical sensors
  • Sensor node on-chip
  • Energy harvesting Sensor

Published Papers (5 papers)

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Research

38 pages, 6439 KiB  
Article
A Robust Automated Analog Circuits Classification Involving a Graph Neural Network and a Novel Data Augmentation Strategy
by Ali Deeb, Abdalrahman Ibrahim, Mohamed Salem, Joachim Pichler, Sergii Tkachov, Anjeza Karaj, Fadi Al Machot and Kyamakya Kyandoghere
Sensors 2023, 23(6), 2989; https://doi.org/10.3390/s23062989 - 09 Mar 2023
Cited by 5 | Viewed by 2533
Abstract
Analog mixed-signal (AMS) verification is one of the essential tasks in the development process of modern systems-on-chip (SoC). Most parts of the AMS verification flow are already automated, except for stimuli generation, which has been performed manually. It is thus challenging and time-consuming. [...] Read more.
Analog mixed-signal (AMS) verification is one of the essential tasks in the development process of modern systems-on-chip (SoC). Most parts of the AMS verification flow are already automated, except for stimuli generation, which has been performed manually. It is thus challenging and time-consuming. Hence, automation is a necessity. To generate stimuli, subcircuits or subblocks of a given analog circuit module should be identified/classified. However, there currently needs to be a reliable industrial tool that can automatically identify/classify analog sub-circuits (eventually in the frame of a circuit design process) or automatically classify a given analog circuit at hand. Besides verification, several other processes would profit enormously from the availability of a robust and reliable automated classification model for analog circuit modules (which may belong to different levels). This paper presents how to use a Graph Convolutional Network (GCN) model and proposes a novel data augmentation strategy to automatically classify analog circuits of a given level. Eventually, it can be upscaled or integrated within a more complex functional module (for a structure recognition of complex analog circuits), targeting the identification of subcircuits within a more complex analog circuit module. An integrated novel data augmentation technique is particularly crucial due to the harsh reality of the availability of generally only a relatively limited dataset of analog circuits’ schematics (i.e., sample architectures) in practical settings. Through a comprehensive ontology, we first introduce a graph representation framework of the circuits’ schematics, which consists of converting the circuit’s related netlists into graphs. Then, we use a robust classifier consisting of a GCN processor to determine the label corresponding to the given input analog circuit’s schematics. Furthermore, the classification performance is improved and robust by involving a novel data augmentation technique. The classification accuracy was enhanced from 48.2% to 76.6% using feature matrix augmentation, and from 72% to 92% using Dataset Augmentation by Flipping. A 100% accuracy was achieved after applying either multi-Stage augmentation or Hyperphysical Augmentation. Overall, extensive tests of the concept were developed to demonstrate high accuracy for the analog circuit’s classification endeavor. This is solid support for a future up-scaling towards an automated analog circuits’ structure detection, which is one of the prerequisites not only for the stimuli generation in the frame of analog mixed-signal verification but also for other critical endeavors related to the engineering of AMS circuits. Full article
(This article belongs to the Special Issue Integrated Circuits and Technologies for Real-Time Sensing)
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12 pages, 3048 KiB  
Article
Towards Real-Time Monitoring of Thermal Peaks in Systems-on-Chip (SoC)
by Aziz Oukaira, Ahmad Hassan, Mohamed Ali, Yvon Savaria and Ahmed Lakhssassi
Sensors 2022, 22(15), 5904; https://doi.org/10.3390/s22155904 - 07 Aug 2022
Cited by 9 | Viewed by 1833
Abstract
This paper presents a method to monitor the thermal peaks that are major concerns when designing Integrated Circuits (ICs) in various advanced technologies. The method aims at detecting the thermal peak in Systems on Chip (SoC) using arrays of oscillators distributed over the [...] Read more.
This paper presents a method to monitor the thermal peaks that are major concerns when designing Integrated Circuits (ICs) in various advanced technologies. The method aims at detecting the thermal peak in Systems on Chip (SoC) using arrays of oscillators distributed over the area of the chip. Measured frequencies are mapped to local temperatures that are used to produce a chip thermal mapping. Then, an indication of the local temperature of a single heat source is obtained in real-time using the Gradient Direction Sensor (GDS) technique. The proposed technique does not require external sensors, and it provides a real-time monitoring of thermal peaks. This work is performed with Field-Programmable Gate Array (FPGA), which acts as a System-on-Chip, and the detected heat source is validated with a thermal camera. A maximum error of 0.3 °C is reported between thermal camera and FPGA measurements. Full article
(This article belongs to the Special Issue Integrated Circuits and Technologies for Real-Time Sensing)
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17 pages, 8338 KiB  
Article
Non-Destructive Testing Using Eddy Current Sensors for Defect Detection in Additively Manufactured Titanium and Stainless-Steel Parts
by Heba E. Farag, Ehsan Toyserkani and Mir Behrad Khamesee
Sensors 2022, 22(14), 5440; https://doi.org/10.3390/s22145440 - 21 Jul 2022
Cited by 23 | Viewed by 5339
Abstract
In this study, different eddy-current based probe designs (absolute and commercial reflection) are used to detect artificial defects with different sizes and at different depths in parts composed of stainless-steel (316) and titanium (TI-64) made by Laser Additive Manufacturing (LAM). The measured defect [...] Read more.
In this study, different eddy-current based probe designs (absolute and commercial reflection) are used to detect artificial defects with different sizes and at different depths in parts composed of stainless-steel (316) and titanium (TI-64) made by Laser Additive Manufacturing (LAM). The measured defect signal value using the probes is in the range of (20–200) millivolts. Both probes can detect subsurface defects on stainless-steel samples with average surface roughness of 11.6 µm and titanium samples with average surface roughness of 8.7 µm. It is found the signal reading can be improved by adding a coating layer made of thin paper to the bottom of the probes. The layer will decrease the surface roughness effect and smooth out the detected defect signal from any ripples. The smallest subsurface artificial defect size detected by both probes is an artificially made notch with 0.07 mm width and 25 mm length. In addition, both probes detected subsurface artificial blind holes in the range of 0.17 mm–0.3 mm radius. Results show that the absolute probe is more suitable to detect cracks and incomplete fusion holes, whereas the reflection probe is more suitable to detect small diameter blind holes. The setup can be used for defect detection during the additive manufacturing process once the melt pool is solidified. Full article
(This article belongs to the Special Issue Integrated Circuits and Technologies for Real-Time Sensing)
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16 pages, 4911 KiB  
Article
An FPGA-Embedded Brain-Computer Interface System to Support Individual Autonomy in Locked-In Individuals
by Arrigo Palumbo, Nicola Ielpo and Barbara Calabrese
Sensors 2022, 22(1), 318; https://doi.org/10.3390/s22010318 - 01 Jan 2022
Cited by 4 | Viewed by 2618
Abstract
Brain-computer interfaces (BCI) can detect specific EEG patterns and translate them into control signals for external devices by providing people suffering from severe motor disabilities with an alternative/additional channel to communicate and interact with the outer world. Many EEG-based BCIs rely on the [...] Read more.
Brain-computer interfaces (BCI) can detect specific EEG patterns and translate them into control signals for external devices by providing people suffering from severe motor disabilities with an alternative/additional channel to communicate and interact with the outer world. Many EEG-based BCIs rely on the P300 event-related potentials, mainly because they require training times for the user relatively short and provide higher selection speed. This paper proposes a P300-based portable embedded BCI system realized through an embedded hardware platform based on FPGA (field-programmable gate array), ensuring flexibility, reliability, and high-performance features. The system acquires EEG data during user visual stimulation and processes them in a real-time way to correctly detect and recognize the EEG features. The BCI system is designed to allow to user to perform communication and domotic controls. Full article
(This article belongs to the Special Issue Integrated Circuits and Technologies for Real-Time Sensing)
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18 pages, 10530 KiB  
Article
In Vivo Evaluation of a Subcutaneously Injectable Implant with a Low-Power Photoplethysmography ASIC for Animal Monitoring
by Jose Manuel Valero-Sarmiento, Parvez Ahmmed and Alper Bozkurt
Sensors 2020, 20(24), 7335; https://doi.org/10.3390/s20247335 - 21 Dec 2020
Cited by 3 | Viewed by 2775
Abstract
Photoplethysmography is an extensively-used, portable, and noninvasive technique for measuring vital parameters such as heart rate, respiration rate, and blood pressure. The deployment of this technology in veterinary medicine has been hindered by the challenges in effective transmission of light presented by the [...] Read more.
Photoplethysmography is an extensively-used, portable, and noninvasive technique for measuring vital parameters such as heart rate, respiration rate, and blood pressure. The deployment of this technology in veterinary medicine has been hindered by the challenges in effective transmission of light presented by the thick layer of skin and fur of the animal. We propose an injectable capsule system to circumvent these limitations by accessing the subcutaneous tissue to enable reliable signal acquisition even with lower light brightness. In addition to the reduction of power usage, the injection of the capsule offers a less invasive alternative to surgical implantation. Our current prototype combines two application-specific integrated circuits (ASICs) with a microcontroller and interfaces with a commercial light emitting diode (LED) and photodetector pair. These ASICs implement a signal-conditioning analog front end circuit and a frequency-shift keying (FSK) transmitter respectively. The small footprint of the ASICs is the key in the integration of the complete system inside a 40-mm long glass tube with an inner diameter of 4 mm, which enables its injection using a custom syringe similar to the ones used with microchip implants for animal identification. The recorded data is transferred wirelessly to a computer for post-processing by means of the integrated FSK transmitter and a software-defined radio. Our optimized LED duty cycle of 0.4% at a sampling rate of 200 Hz minimizes the contribution of the LED driver (only 0.8 mW including the front-end circuitry) to the total power consumption of the system. This will allow longer recording periods between the charging cycles of the batteries, which is critical given the very limited space inside the capsule. In this work, we demonstrate the wireless operation of the injectable system with a human subject holding the sensor between the fingers and the in vivo functionality of the subcutaneous sensing on a pilot study performed on anesthetized rat subjects. Full article
(This article belongs to the Special Issue Integrated Circuits and Technologies for Real-Time Sensing)
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