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Toward Nano Materials for Flexible Sensors: Opportunities and Outlook

A special issue of Sensors (ISSN 1424-8220). This special issue belongs to the section "Biosensors".

Deadline for manuscript submissions: closed (31 January 2024)

Special Issue Editors


E-Mail Website
Guest Editor
Key Laboratory of Flexible Printed Electronics Technology, School of Science, Harbin Institute of Technology, Shenzhen 518057, China
Interests: analytical chemistry; pharmaceutical analysis; biosensors and chemosensors; electrochemistry; microfluidics
Special Issues, Collections and Topics in MDPI journals

E-Mail Website
Guest Editor
Harbin Institute of Technology, Harbin, China
Interests: microfluidic chip

Special Issue Information

Dear Colleagues,

Nano materials and flexible sensors have received tremendous development in recent years and have been influencing our lives from individuals to the whole society. Nano materials exhibit exceptional multifunctional properties including high surface to volume ratios, various unique structures, and mechanical compliance, causing the class of materials to be powerful in advanced flexible sensors for applications in a variety of fields. However, there are still pending challenges impeding the commercialization of these products, in terms of poor stability, complicated fabrication, high cost, unfavorable sensitivity and accuracy, etc. Toward addressing these issues, we welcome submissions presenting novel and interesting materials, techniques, methods, and devices related to flexible sensors and their potential applications.

Areas of interest include, but are not limited to, the following topics:

(1) Nano materials for flexible sensors: plastic, molecular and inorganic systems, 1D/2D/3D nano materials, biomaterials, self-assembled materials, mimetic materials, etc.
(2) Flexible sensors and their applications: bioelectronics and health monitoring, electronic skin, sensors and actuators, optoelectronics, computing, robotics, etc.
(3) Fabrication and processing of flexible sensors: lithography, printing, solution processing, patterning, self-assembly, device integration, etc.
(4) Material properties and phenomena relevant for flexible sensors, including device physics.
(5) Architecture, simulation, theoretical calculation, calibration, and testing related to flexible sensors.
(6) Working mechanisms of flexible sensor response.

Prof. Dr. Yinching Li
Dr. Jiao Yang
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Sensors is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • nano materials
  • flexible sensors
  • electronic skin
  • wearables
  • transducers
  • healthcare
  • biomarkers

Published Papers

There is no accepted submissions to this special issue at this moment.
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