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Sensing Technologies in Additive Manufacturing

A special issue of Sensors (ISSN 1424-8220). This special issue belongs to the section "Physical Sensors".

Deadline for manuscript submissions: 31 August 2024 | Viewed by 575

Special Issue Editor


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Guest Editor
Department of Mechanical and Mechatronics Engineering, University of Waterloo, Waterloo, ON N2L 3W8, Canada
Interests: sensors; printed electronics; additive manufacturing
Special Issues, Collections and Topics in MDPI journals

Special Issue Information

Dear Colleagues,

The integration of sensors into additively manufacturing technologies and printed parts has huge potential to address critical aspects, such as monitoring, control, optimization, defect detection, and prevention. This Special Issue explores the cutting-edge applications of sensing technology in various additive manufacturing processes, including Laser Powder Bed Fusion, Directed Energy Deposition, Electron Beam, Binder Jetting, Wire Arc Additive, and Solid-State additive manufacturing.

These are the key topics of this Special Issue:

  • Innovative sensor technologies for monitoring, control, and optimizing printing processes and enhancing efficiency.
  • Utilizing sensors for real-time defect detection and prevention, guaranteeing the production of high-quality parts.
  • The incorporation of artificial intelligence in conjunction with sensors for online monitoring and the adaptive control of manufacturing processes.
  • Embedding sensors within manufactured components to create smart parts that can provide real-time data about their performance and health throughout their lifecycle.
  • Employing Additive Manufacturing technologies for direct writing on 3D parts.

Dr. Ehsan Marzbanrad
Guest Editor

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Sensors is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • additive manufacturing
  • sensor
  • process control
  • artificial intelligence
  • printable sensors
  • smart parts

Published Papers (1 paper)

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Research

13 pages, 5393 KiB  
Article
Adaptive Fabrication of Electrochemical Chips with a Paste-Dispensing 3D Printer
by Ten It Wong, Candy Ng, Shengxuan Lin, Zhong Chen and Xiaodong Zhou
Sensors 2024, 24(9), 2844; https://doi.org/10.3390/s24092844 - 29 Apr 2024
Viewed by 359
Abstract
Electrochemical (EC) detection is a powerful tool supporting simple, low-cost, and rapid analysis. Although screen printing is commonly used to mass fabricate disposable EC chips, its mask is relatively expensive. In this research, we demonstrated a method for fabricating three-electrode EC chips using [...] Read more.
Electrochemical (EC) detection is a powerful tool supporting simple, low-cost, and rapid analysis. Although screen printing is commonly used to mass fabricate disposable EC chips, its mask is relatively expensive. In this research, we demonstrated a method for fabricating three-electrode EC chips using 3D printing of relatively high-viscosity paste. The electrodes consisted of two layers, with carbon paste printed over silver/silver chloride paste, and the printed EC chips were baked at 70 °C for 1 h. Engineering challenges such as bulging of the tubing, clogging of the nozzle, dripping, and local accumulation of paste were solved by material selection for the tube and nozzle, and process optimization in 3D printing. The EC chips demonstrated good reversibility in redox reactions through cyclic voltammetry tests, and reliably detected heavy metal ions Pb(II) and Cd(II) in solutions using differential pulse anodic stripping voltammetry measurements. The results indicate that by optimizing the 3D printing of paste, EC chips can be obtained by maskless and flexible 3D printing techniques in lieu of screen printing. Full article
(This article belongs to the Special Issue Sensing Technologies in Additive Manufacturing)
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Planned Papers

The below list represents only planned manuscripts. Some of these manuscripts have not been received by the Editorial Office yet. Papers submitted to MDPI journals are subject to peer-review.

Dear Colleagues,

The integration of sensors into additively manufacturing technologies and printed parts has huge potential to address critical aspects, such as monitoring, control, optimization, defect detection, and prevention. This Special Issue explores the cutting-edge applications of sensing technology in various additive manufacturing processes, including Laser Powder Bed Fusion, Directed Energy Deposition, Electron Beam, Binder Jetting, Wire Arc Additive, and Solid-State additive manufacturing.

These are the key topics of this Special Issue:

  • Innovative sensor technologies for monitoring, control, and optimizing printing processes and enhancing efficiency.
  • Utilizing sensors for real-time defect detection and prevention, guaranteeing the production of high-quality parts.
  • The incorporation of artificial intelligence in conjunction with sensors for online monitoring and the adaptive control of manufacturing processes.
  • Embedding sensors within manufactured components to create smart parts that can provide real-time data about their performance and health throughout their lifecycle.
  • Employing Additive Manufacturing technologies for direct writing on 3D parts.
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