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MEMS and NEMS Sensors for Engineered Systems
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MEMS and NEMS Sensors for Engineered Systems

A special issue of Sensors (ISSN 1424-8220). This special issue belongs to the section "Electronic Sensors".

Deadline for manuscript submissions: closed (31 January 2024) | Viewed by 1382

Special Issue Editors

Dr. Debbie G. Senesky

E-Mail Website
Guest Editor
Aeronautics and Astronautics Department, Stanford University, Durand Building #254, 496 Lomita Mall, Stanford, CA 94305, USA
Interests: harsh environment sensors; wide bandgap semiconductors; compound semiconductors; high-temperature instrumentation; radiation hardened semiconductors; semiconductor sensors; optical sensors; chemical sensors; micromechanical resonators; energy harvesters; piezoelectricity; microfabrication; nanotechnology
Special Issues, Collections and Topics in MDPI journals
Dr. Kris L. Dorsey

E-Mail Website
Guest Editor
Electrical and Computer Engineering Department, Northeastern University, ISEC 509, 360 Columbus Avenue, Boston, MA 02115, USA
Interests: wearable sensors; soft robotics; mechanical sensors; MEMS; microfabrication; additive manufacturing

Special Issue Information

Dear Colleagues,

Since the first related works were published in the 1960s, MEMS and NEMS have been focused on real-world applications. Advances in modeling, fabrication, and performance mean that MEMS and NEMS sensors are a part of daily life, and micro- and nano-scale sensors research has largely moved from specific performance challenges to investigations that integrate MEMS and NEMS sensors with real-world applications. This Special Issue will showcase work in the interface between MEMS and NEMS sensors and the specific engineered system in which it is deployed. We are particularly interested in research on interfaces between novel MEMS or NEMS sensors and other systems, successes in deploying MEMS and NEMS sensors to measure novel or heretofore unprecedented system performance, and novel approaches for integrating commercial MEMS or NEMS sensors with engineered systems.

Dr. Debbie G. Senesky
Dr. Kris L. Dorsey
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Sensors is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • microsystems
  • MEMS
  • NEMS
  • measurement science
  • microfabrication
  • nanofabrication

Published Papers (1 paper)

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Research

12 pages, 3342 KiB  
Communication
High-Power-Efficiency Readout Circuit Employing Average Capacitance-to-Voltage Converter for Micro-Electro-Mechanical System Capacitive Accelerometers
by Linxi Li, Xinquan Lai, Yuheng Wang and Zhiwen Niu
Sensors 2023, 23(20), 8547; https://doi.org/10.3390/s23208547 - 18 Oct 2023
Cited by 1 | Viewed by 1052
Abstract
A capacitance-to-voltage converter (CVC) is proposed in this paper and applied to a readout circuit for a micro-electro-mechanical system (MEMS) accelerometer to improve the power efficiency. In a traditional readout circuit, the front-end CVC has to operate at a high sampling frequency to [...] Read more.
A capacitance-to-voltage converter (CVC) is proposed in this paper and applied to a readout circuit for a micro-electro-mechanical system (MEMS) accelerometer to improve the power efficiency. In a traditional readout circuit, the front-end CVC has to operate at a high sampling frequency to resist thermal noise deterioration due to the large parasitic capacitance introduced by the mechanical sensing element. Thus, the back-end analog-to-digital converter (ADC) also has to operate at a high sampling frequency to avoid noise aliasing when sampling the output signal of the CVC, which leads to high power consumption. The average CVC technique is proposed in this paper to reduce the sampling frequency requirement of the back-end ADC and thus reduce the power consumption. Both the traditional readout circuit and the proposed readout circuit are simulated with a commercial 0.18 μm BCD process. The simulation results show that noise aliasing occurs, and the noise power spectral density (PSD) of the traditional readout circuit increases by 12 dB when the sampling frequency of back-end ADC is reduced by 24 dB. However, in the proposed readout circuit, a noise aliasing effect does not occur. Moreover, the proposed readout circuit reduces the power consumption by 53% without thermal noise deterioration. In addition, the proposed CVC circuits are fabricated in an 0.18 μm BCD process, and the test results show that the presented readout circuit based on the average CVC technique can obtain better performance than the traditional CVC-based readout circuit. Full article
(This article belongs to the Special Issue MEMS and NEMS Sensors for Engineered Systems)
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