Non-Visual Sensors in CMOS Technologies

Dear Colleagues,

The global sensor market is rapidly expanding, with new business opportunities in IoT, consumer electronics, automotive industry, robotics, and healthcare. This Special Issue of Sensors is focused on practical sensor solutions in production CMOS facilities. Papers are supposed to report on sensors for various applications, including traditional sensor approaches and emerging solutions at the stage or close to the stage of their implementation. The Special Issue is seen as an opportunity to present challenging results to an interdisciplinary research and engineering community and discuss the practical value of suggested/investigated ideas and devices.

Diverse sensors, including proximity, temperature, pressure, acceleration, humidity, magnetic field, gas diagnostics, and radiation monitoring, fabricated in CMOS production technologies, including MEMS processing, are within the scope of the Special Issue. Visual light CMOS imagers are excluded, since they are represented in other specialized journal issues. Nevertheless, IR and UV imaging devices fabricated using CMOS/MEMS process flows are within the scope of this Special Issue.

Papers reporting the results of cooperation between startup companies, academic institutions, and the semiconductor industry, focused on the implementation of new types of sensors and using novel sensing approaches, are especially welcome.

This Special Issue invites contributions on the following topics (but is not limited to them):

• Silicon sensors in core CMOS technologies;
• Integrated MEMS sensors and sensors using elements of MEMS processing;
• Sensors based on alternative materials integrated into the CMOS back end;
• Sensors using alternative materials that are integrated with CMOS by wafer bonding or chip-on-wafer technologies;
• Systems in a package with CMOS sensing elements or/and CMOS for data processing;
• Schematic solutions for sensor data processing implemented on CMOS chips;
• Modeling of sensors and sensor design enablement.

Prof. Dr. Yael Nemirovsky
Prof. Dr. Yakov Roizin
Guest Editors

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