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Materials and Packaging for Optical Sensors
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Materials and Packaging for Optical Sensors

A special issue of Sensors (ISSN 1424-8220). This special issue belongs to the section "Optical Sensors".

Deadline for manuscript submissions: closed (31 December 2021) | Viewed by 5365

Special Issue Editor

Prof. Dr. Ralf Hellmann

E-Mail Website
Guest Editor
Applied Laser and Photonics Group, University of Applied Science Aschaffenburg, 63743 Aschaffenburg, Germany
Interests: applied optics and lasers; bragg grating-based sensors; laser material processing; additive manufacturing; nanotechnology; applied materials
Special Issues, Collections and Topics in MDPI journals

Special Issue Information

Dear Colleagues,

Optical sensors have evolved to be one of the most studied and applied sensing techniques in industrial, engineering, medical, and biological applications. Compared to other types of sensors that deploy electronic or mechanical transduction, optical sensors are characterized by remarkable advantages in terms of sensitivity, selectivity, response time, and the capability to realize remote sensing while being distinguished by the absence of electromagnetic susceptibility. As a result, a diverse range of optical sensing technologies has been developed and applied. This development has, to a significant extent, been promoted by material innovations and developments of packaging techniques for integrated photonic devices.

This Special Issue on “Materials and Packaging for Optical Sensors” concentrates on all aspects of fundamental, applied, and interdisciplinary research with a particular focus on optical material developments, packaging, and integration approaches, as well as novel designs of optical sensors and sensor systems.

Both, original research papers as well as review papers are welcome.

Topics of interests include, but are not limited to the following:

  • Design and construction of optical sensors
  • Material developments for optical sensors (e.g., semiconductor, glass, polymers, graphene, photonic crystals)
  • Innovative approaches for photonic or optoelectronic transducers
  • Packaging of optical sensors to embedded systems
  • Joining, Integration, and assembly of optical sensors
  • Novel materials, components, and systems for optical sensing
  • Manufacturing techniques for optical sensors

This Special Issue will compile and highlight innovative research on materials for optical sensors and recent developments for packaging and integration approaches for optical sensors in embedded systems and into any particular measurement environment.

Prof. Ralf Hellmann
Guest Editor

Prof. Dr. Ralf Hellmann
Guest Editor

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Sensors is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • Design and construction of optical sensors
  • Material developments for optical sensors (e.g., semiconductor, glass, polymers, graphene, photonic crystals)
  • Innovative approaches for photonic or optoelectronic transducers
  • Packaging of optical sensors to embedded systems
  • Joining, Integration, and assembly of optical sensors
  • Novel materials, components, and systems for optical sensing
  • Manufacturing techniques for optical sensor

Published Papers (2 papers)

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Research

17 pages, 4856 KiB  
Article
Techniques and Materials for Optical Fiber Sensors Sealing in Dynamic Environments with High Pressure and High Temperature
by Joao Batista Rosolem, Rivael Strobel Penze, Claudio Floridia, Rodrigo Peres, Deleon Vasconcelos and Marcelo Agra Ramos Junior
Sensors 2021, 21(19), 6531; https://doi.org/10.3390/s21196531 - 30 Sep 2021
Cited by 3 | Viewed by 2244
Abstract
We detail a study of the techniques and sealing materials for optical fiber sensors used in dynamic environments with high pressure (>300 bar) and high temperature (>300 °C). The sealing techniques and materials are the key for the robustness of sensors in harsh [...] Read more.
We detail a study of the techniques and sealing materials for optical fiber sensors used in dynamic environments with high pressure (>300 bar) and high temperature (>300 °C). The sealing techniques and materials are the key for the robustness of sensors in harsh dynamic environments, such as large combustion engines. The sealing materials and techniques studied in this work are high-temperature epoxies, metallic polymer, metallic solders, glass solder, cement, brazing and electroless nickel plating. Because obtaining high temperature simultaneously with high pressure is very difficult in the same chamber in the laboratory, we developed a new and simple method to test sealed fibers in these conditions in the laboratory. In addition, some sensors using the materials tested in the laboratory were also field tested in real thermoelectric combustion engines. The study also discusses the methods of fabrication and the cost−benefit ratio of each method. Full article
(This article belongs to the Special Issue Materials and Packaging for Optical Sensors)
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12 pages, 3613 KiB  
Article
Microstructure-Based Fiber-To-Chip Coupling of Polymer Planar Bragg Gratings for Harsh Environment Applications
by Stefan Kefer, Theresia Sauer, Steffen Hessler, Michael Kaloudis and Ralf Hellmann
Sensors 2020, 20(19), 5452; https://doi.org/10.3390/s20195452 - 23 Sep 2020
Cited by 5 | Viewed by 2085
Abstract
This article proposes and demonstrates a robust microstructure-based fiber-to-chip coupling scheme for planar Bragg grating devices. A polymer planar Bragg grating substrate is manufactured and microstructured by means of a micromilling process, while the respective photonic structures are generated by employing a sophisticated [...] Read more.
This article proposes and demonstrates a robust microstructure-based fiber-to-chip coupling scheme for planar Bragg grating devices. A polymer planar Bragg grating substrate is manufactured and microstructured by means of a micromilling process, while the respective photonic structures are generated by employing a sophisticated single-writing UV-exposure method. A stripped standard single-mode fiber is inserted into the microstructure, which is filled with a UV-curable adhesive, and aligned with the integrated waveguide. After curing, final sensor assembly and thermal treatment, the proposed coupling scheme is capable of withstanding pressures up to 10 bar, at room temperature, and pressures up to 7.5 bar at an elevated temperature of 120 °C. Additionally, the coupling scheme is exceedingly robust towards tensile forces, limited only by the tensile strength of the employed single-mode fiber. Due to its outstanding robustness, the coupling scheme enables the application of planar Bragg grating devices in harsh environments. This fact is underlined by integrating a microstructure-coupled photonic device into the center of a commercial-grade carbon fiber reinforced polymer specimen. After its integration, the polymer-based Bragg grating sensor still exhibits a reflection peak with a dynamic range of 24 dB, and can thus be employed for sensing purposes. Full article
(This article belongs to the Special Issue Materials and Packaging for Optical Sensors)
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