2D Vertical Heterostructures with Covalent Interlayer Bonding

A special issue of Surfaces (ISSN 2571-9637).

Deadline for manuscript submissions: closed (31 March 2022) | Viewed by 421

Special Issue Editor


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Guest Editor
Research and Education Center “Silicon and Carbon Nanotechnologies”, Ulyanovsk State University, 42 Leo Tolstoy Str., 432017 Ulyanovsk, Russia
Interests: graphenes; non-carbon 2D materials; nanoribbons; van der Waals heterostructures; piezoelectric properties; elastic waves

Special Issue Information

Dear Colleagues,

Innovative developments in the field of two-dimensional (2D) nanoelectromechanical, nanoelectronic and photovoltaic systems have led to the need to integrate two-dimensional materials with each other. "Splicing" of two-dimensional materials, apart from the trivial case of lateral contacts, is provided mainly by electrostatic dipole forces known as van der Waals (vdW) interaction. To date, several dozen types of such heterostructures have been created and investigated, and they have already shown a huge potential for the development of this direction of nanotechnology.

Emphasis of this Special Issue will be on collecting fundamental studies, experimental research, numerical approaches, analysis tools, design guidelines dealing with new compounds—2D vertical heterostructures with covalent interlayer bonding. Expected features are quite promising for the design of new devices based on the covalent bonding of 2D materials.

Dr. Aleksey Kochaev
Guest Editor

Manuscript Submission Information

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Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 1600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • 2D materials
  • graphenes
  • Van der Waals heterostructures
  • covalent bonding
  • mechanical characteristic
  • binding energy
  • optical properties

Published Papers

There is no accepted submissions to this special issue at this moment.
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