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Article

The Effect of Copper Sulfide Stoichiometric Coefficient and Morphology on Electrochemical Performance

by
Yanhong Ding
1,*,
Rongpeng Lin
1,
Shuicheng Xiong
1,
Yirong Zhu
1,*,
Meng Yu
1 and
Xiaobo Duan
2
1
College of Materials and Advanced Manufacturing, Hunan University of Technology, Zhuzhou 412008, China
2
GEM Co., Ltd., Shenzhen 518101, China
*
Authors to whom correspondence should be addressed.
Molecules 2023, 28(6), 2487; https://doi.org/10.3390/molecules28062487
Submission received: 12 February 2023 / Revised: 28 February 2023 / Accepted: 3 March 2023 / Published: 8 March 2023
(This article belongs to the Special Issue Novel Electrode Materials for Rechargeable Batteries)
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Abstract

In this work, CuS, Cu7S4, Cu9S5, Cu7.2S4, and Cu2S with the same morphology were successfully synthesized by the hydrothermal method. According to the calculation, their galvanostatic charge-discharge (GCD) curves were 43.29 (CuS), 86.3 (Cu7S4), 154 (Cu9S5), 185.4 (Cu7.2S4), and 206.9 F/g (Cu2S) at the current density of 1 A/g. The results showed that the energy storage capacity of copper sulfide with the same morphology increased with the increase of the copper sulfide stoichiometric coefficient. At the second part of this work, the agglomerated cuprous sulfide and the microporous cuprous sulfide were successfully prepared, respectively. In addition, the porous spherical cuprous sulfide was annealed to get nano cuprous sulfide. It is found that the specific capacity of the agglomerated structure is the highest, which had reached 206.9 F/g at the current density of 1 A/g, and 547.9 F/g at the current density of 10 A/g after activation.
Keywords: copper sulfide; supercapacitor; specific capacity; hydrothermal method; morphology copper sulfide; supercapacitor; specific capacity; hydrothermal method; morphology

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MDPI and ACS Style

Ding, Y.; Lin, R.; Xiong, S.; Zhu, Y.; Yu, M.; Duan, X. The Effect of Copper Sulfide Stoichiometric Coefficient and Morphology on Electrochemical Performance. Molecules 2023, 28, 2487. https://doi.org/10.3390/molecules28062487

AMA Style

Ding Y, Lin R, Xiong S, Zhu Y, Yu M, Duan X. The Effect of Copper Sulfide Stoichiometric Coefficient and Morphology on Electrochemical Performance. Molecules. 2023; 28(6):2487. https://doi.org/10.3390/molecules28062487

Chicago/Turabian Style

Ding, Yanhong, Rongpeng Lin, Shuicheng Xiong, Yirong Zhu, Meng Yu, and Xiaobo Duan. 2023. "The Effect of Copper Sulfide Stoichiometric Coefficient and Morphology on Electrochemical Performance" Molecules 28, no. 6: 2487. https://doi.org/10.3390/molecules28062487

APA Style

Ding, Y., Lin, R., Xiong, S., Zhu, Y., Yu, M., & Duan, X. (2023). The Effect of Copper Sulfide Stoichiometric Coefficient and Morphology on Electrochemical Performance. Molecules, 28(6), 2487. https://doi.org/10.3390/molecules28062487

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