Cui, K.; Wang, Y.; Yan, W.; Cao, T.; Du, Y.; Wu, K.; Guo, L.
Investigation on the Underlying Mechanisms of the Mechanical and Electrical Enhancement of Nano-SiO2-Doped Epoxy Resins: A Molecular Simulation Study. Molecules 2025, 30, 2960.
https://doi.org/10.3390/molecules30142960
AMA Style
Cui K, Wang Y, Yan W, Cao T, Du Y, Wu K, Guo L.
Investigation on the Underlying Mechanisms of the Mechanical and Electrical Enhancement of Nano-SiO2-Doped Epoxy Resins: A Molecular Simulation Study. Molecules. 2025; 30(14):2960.
https://doi.org/10.3390/molecules30142960
Chicago/Turabian Style
Cui, Kunqi, Yang Wang, Wenchao Yan, Teng Cao, Yan Du, Kai Wu, and Li Guo.
2025. "Investigation on the Underlying Mechanisms of the Mechanical and Electrical Enhancement of Nano-SiO2-Doped Epoxy Resins: A Molecular Simulation Study" Molecules 30, no. 14: 2960.
https://doi.org/10.3390/molecules30142960
APA Style
Cui, K., Wang, Y., Yan, W., Cao, T., Du, Y., Wu, K., & Guo, L.
(2025). Investigation on the Underlying Mechanisms of the Mechanical and Electrical Enhancement of Nano-SiO2-Doped Epoxy Resins: A Molecular Simulation Study. Molecules, 30(14), 2960.
https://doi.org/10.3390/molecules30142960