Liu, D.; Liu, H.; Liu, J.; Hu, F.; Fan, J.; Wu, W.; Tu, L.
Temperature Gradient Method for Alleviating Bonding-Induced Warpage in a High-Precision Capacitive MEMS Accelerometer. Sensors 2020, 20, 1186.
https://doi.org/10.3390/s20041186
AMA Style
Liu D, Liu H, Liu J, Hu F, Fan J, Wu W, Tu L.
Temperature Gradient Method for Alleviating Bonding-Induced Warpage in a High-Precision Capacitive MEMS Accelerometer. Sensors. 2020; 20(4):1186.
https://doi.org/10.3390/s20041186
Chicago/Turabian Style
Liu, Dandan, Huafeng Liu, Jinquan Liu, Fangjing Hu, Ji Fan, Wenjie Wu, and Liangcheng Tu.
2020. "Temperature Gradient Method for Alleviating Bonding-Induced Warpage in a High-Precision Capacitive MEMS Accelerometer" Sensors 20, no. 4: 1186.
https://doi.org/10.3390/s20041186
APA Style
Liu, D., Liu, H., Liu, J., Hu, F., Fan, J., Wu, W., & Tu, L.
(2020). Temperature Gradient Method for Alleviating Bonding-Induced Warpage in a High-Precision Capacitive MEMS Accelerometer. Sensors, 20(4), 1186.
https://doi.org/10.3390/s20041186