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Journal: Sensors, 2020
Volume: 20
Number: 1186
Article:
Temperature Gradient Method for Alleviating Bonding-Induced Warpage in a High-Precision Capacitive MEMS Accelerometer
Authors:
by
Dandan Liu, Huafeng Liu, Jinquan Liu, Fangjing Hu, Ji Fan, Wenjie Wu and Liangcheng Tu
Link:
https://www.mdpi.com/1424-8220/20/4/1186
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