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Journal: EnergiesVolume: 17Number: 5692
Article: Analysis of Key Factors Affecting Case-to-Ambient Thermal Resistance in Thermal Modeling of Power Devices
  • Authors:
  • Kaixin Wei1,2,
  • Peiji Shi1,* and
  • Pili Bao1
  • et al.
Link: https://www.mdpi.com/1996-1073/17/22/5692

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