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Journal: Materials, 2022
Volume: 15
Number: 8419

Article: Diffusion Barrier Properties of the Intermetallic Compound Layers Formed in the Pt Nanoparticles Alloyed Sn-58Bi Solder Joints Reacted with ENIG and ENEPIG Surface Finishes
Authors: by Hyeokgi Choi, Chang-Lae Kim and Yoonchul Sohn
Link: https://www.mdpi.com/1996-1944/15/23/8419

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