Meng, Y.; He, Y.; Wang, C.; Ma, Y.; Guo, L.; Jiao, J.; He, Y.
The Effect of Surface Electroplating on Fragment Deformation Behavior When Subjected to Contact Blasts. Materials 2023, 16, 5464.
https://doi.org/10.3390/ma16155464
AMA Style
Meng Y, He Y, Wang C, Ma Y, Guo L, Jiao J, He Y.
The Effect of Surface Electroplating on Fragment Deformation Behavior When Subjected to Contact Blasts. Materials. 2023; 16(15):5464.
https://doi.org/10.3390/ma16155464
Chicago/Turabian Style
Meng, Yuanpei, Yuan He, Chuanting Wang, Yue Ma, Lei Guo, Junjie Jiao, and Yong He.
2023. "The Effect of Surface Electroplating on Fragment Deformation Behavior When Subjected to Contact Blasts" Materials 16, no. 15: 5464.
https://doi.org/10.3390/ma16155464
APA Style
Meng, Y., He, Y., Wang, C., Ma, Y., Guo, L., Jiao, J., & He, Y.
(2023). The Effect of Surface Electroplating on Fragment Deformation Behavior When Subjected to Contact Blasts. Materials, 16(15), 5464.
https://doi.org/10.3390/ma16155464