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Journal: Materials, 2023
Volume: 16
Number: 5822

Article: Recrystallization and Grain Growth in Cu-Cu Joints under Electromigration at Low Temperatures
Authors: by Shih-Chi Yang, Dinh-Phuc Tran and Chih Chen
Link: https://www.mdpi.com/1996-1944/16/17/5822

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