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Journal: Materials, 2023
Volume: 16
Number: 5955
Article:
A Novel Molecular PCM Wall with Inorganic Composite: Dynamic Thermal Analysis and Optimization in Charge–Discharge Cycles
Authors:
by
Qianru Yang, Jianwu Xiong, Gang Mao and Yin Zhang
Link:
https://www.mdpi.com/1996-1944/16/17/5955
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