Qin, J.; Li, X.; Wang, D.; Zhou, C.; Hu, T.; Wang, J.; Yang, Y.; Hu, Y.
Microstructure and Texture Evolution in Cold-Rolled and Annealed Oxygen-Free Copper Sheets. Materials 2024, 17, 2202.
https://doi.org/10.3390/ma17102202
AMA Style
Qin J, Li X, Wang D, Zhou C, Hu T, Wang J, Yang Y, Hu Y.
Microstructure and Texture Evolution in Cold-Rolled and Annealed Oxygen-Free Copper Sheets. Materials. 2024; 17(10):2202.
https://doi.org/10.3390/ma17102202
Chicago/Turabian Style
Qin, Jing, Xun Li, Dongsheng Wang, Chen Zhou, Tongsheng Hu, Jingwen Wang, Youwen Yang, and Yujun Hu.
2024. "Microstructure and Texture Evolution in Cold-Rolled and Annealed Oxygen-Free Copper Sheets" Materials 17, no. 10: 2202.
https://doi.org/10.3390/ma17102202
APA Style
Qin, J., Li, X., Wang, D., Zhou, C., Hu, T., Wang, J., Yang, Y., & Hu, Y.
(2024). Microstructure and Texture Evolution in Cold-Rolled and Annealed Oxygen-Free Copper Sheets. Materials, 17(10), 2202.
https://doi.org/10.3390/ma17102202