Lu, T.-F.; Yen, Y.-T.; Cheng, Y.-F.; Wang, P.-W.; Wu, Y.S.
Enhancement of Abnormal Grain Growth by Surface Quenching Treatment to Eliminate Cu–Cu Bonding Interfaces Using (111)-Oriented Nanotwinned Copper. Materials 2024, 17, 3245.
https://doi.org/10.3390/ma17133245
AMA Style
Lu T-F, Yen Y-T, Cheng Y-F, Wang P-W, Wu YS.
Enhancement of Abnormal Grain Growth by Surface Quenching Treatment to Eliminate Cu–Cu Bonding Interfaces Using (111)-Oriented Nanotwinned Copper. Materials. 2024; 17(13):3245.
https://doi.org/10.3390/ma17133245
Chicago/Turabian Style
Lu, Tsan-Feng, Yu-Ting Yen, Yuan-Fu Cheng, Pei-Wen Wang, and YewChung Sermon Wu.
2024. "Enhancement of Abnormal Grain Growth by Surface Quenching Treatment to Eliminate Cu–Cu Bonding Interfaces Using (111)-Oriented Nanotwinned Copper" Materials 17, no. 13: 3245.
https://doi.org/10.3390/ma17133245
APA Style
Lu, T. -F., Yen, Y. -T., Cheng, Y. -F., Wang, P. -W., & Wu, Y. S.
(2024). Enhancement of Abnormal Grain Growth by Surface Quenching Treatment to Eliminate Cu–Cu Bonding Interfaces Using (111)-Oriented Nanotwinned Copper. Materials, 17(13), 3245.
https://doi.org/10.3390/ma17133245