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Journal: Materials, 2024
Volume: 17
Number: 4953

Article: The Impact of Substrate Temperature on the Adhesion Strength of Electroplated Copper on an Al-Doped ZnO/Si System
Authors: by Jiun-Yi Tseng, Wen-Jauh Chen and Ping-Hang Chen
Link: https://www.mdpi.com/1996-1944/17/20/4953

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