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Journal: Materials, 2024
Volume: 17
Number: 724

Article: Improvement of PbSn Solder Reliability with Ge Microalloying-Induced Optimization of Intermetallic Compounds Growth
Authors: by Zhibo Qu, Yilong Hao, Changhao Chen, Yong Wang, Shimeng Xu, Shuyuan Shi, Pengrong Lin and Xiaochen Xie
Link: https://www.mdpi.com/1996-1944/17/3/724

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