Zawada-Michałowska, M.; Pieśko, P.; Mrówka-Nowotnik, G.; Nowotnik, A.; Legutko, S.
Effect of the Technological Parameters of Milling on Residual Stress in the Surface Layer of Thin-Walled Plates. Materials 2024, 17, 1193.
https://doi.org/10.3390/ma17051193
AMA Style
Zawada-Michałowska M, Pieśko P, Mrówka-Nowotnik G, Nowotnik A, Legutko S.
Effect of the Technological Parameters of Milling on Residual Stress in the Surface Layer of Thin-Walled Plates. Materials. 2024; 17(5):1193.
https://doi.org/10.3390/ma17051193
Chicago/Turabian Style
Zawada-Michałowska, Magdalena, Paweł Pieśko, Grażyna Mrówka-Nowotnik, Andrzej Nowotnik, and Stanisław Legutko.
2024. "Effect of the Technological Parameters of Milling on Residual Stress in the Surface Layer of Thin-Walled Plates" Materials 17, no. 5: 1193.
https://doi.org/10.3390/ma17051193
APA Style
Zawada-Michałowska, M., Pieśko, P., Mrówka-Nowotnik, G., Nowotnik, A., & Legutko, S.
(2024). Effect of the Technological Parameters of Milling on Residual Stress in the Surface Layer of Thin-Walled Plates. Materials, 17(5), 1193.
https://doi.org/10.3390/ma17051193