Hu, J.; Wang, Q.; Wang, K.; Wang, W.; Qiang, F.; Li, L.
Coupled Temperature–Flow Field and Microstructure Numerical Simulation of the Solidification Process for Cu-3Ti-0.2Fe Alloy. Materials 2025, 18, 2478.
https://doi.org/10.3390/ma18112478
AMA Style
Hu J, Wang Q, Wang K, Wang W, Qiang F, Li L.
Coupled Temperature–Flow Field and Microstructure Numerical Simulation of the Solidification Process for Cu-3Ti-0.2Fe Alloy. Materials. 2025; 18(11):2478.
https://doi.org/10.3390/ma18112478
Chicago/Turabian Style
Hu, Jiangwei, Qingjuan Wang, Kuaishe Wang, Wen Wang, Fengming Qiang, and Longxin Li.
2025. "Coupled Temperature–Flow Field and Microstructure Numerical Simulation of the Solidification Process for Cu-3Ti-0.2Fe Alloy" Materials 18, no. 11: 2478.
https://doi.org/10.3390/ma18112478
APA Style
Hu, J., Wang, Q., Wang, K., Wang, W., Qiang, F., & Li, L.
(2025). Coupled Temperature–Flow Field and Microstructure Numerical Simulation of the Solidification Process for Cu-3Ti-0.2Fe Alloy. Materials, 18(11), 2478.
https://doi.org/10.3390/ma18112478