Advanced Recovery Techniques for Waste Materials from IT and Telecommunication Equipment Printed Circuit Boards
Abstract
:1. Introduction
- Category 1 covers large household appliances (fridges, washing machines, air conditioners, etc.);
- Category 2 covers small household appliances (vacuum cleaners, toasters, fryers, etc.);
- Category 3 covers IT and telecommunication equipment (ITTE) (PCs, tablets, notebooks, smartphones, etc.);
- Category 4 covers consumer equipment (e.g., TVs, stereo systems, digital cameras, etc.).
2. Recycling Techniques of WPCBs
2.1. Disassembly Process
- Input and output product analysis. During the first phase, reusable, important, and hazardous components and materials are specified. Optimum disassembly is defined after preliminary cost analysis.
- Assembly analysis. Attachment components, part hierarchy, and previous assembly sequences are analyzed during the second phase.
- Uncertainty issues analysis. Defective parts or joints in the incoming material or product upgrading/downgrading during use may cause disassembly instability and damage to disassembly.
- Determination of the dismantling strategy. The final phase determines whether non-destructive or destructive disassembly is going to be used.
2.2. Mechanical Recycling Techniques
- Washing, drying, and comminution. The disassembled materials from PCBs are washed for the removal of adhered impurities and dried. This process minimizes the particle surface contamination that could affect the reproducibility and efficiency of the tribo-charging mechanism [72]. The polymers are then ground in a knife mill. These activities result in wastewater (from the washing process) and dust, noise, and vibrations (from the grinding process). Therefore, further measures are required in order to reduce the environmental impact.
- Sieving. The particle size directly affects the tribo-electrostatic separation [73]. Thus, a granulometric separation is carried out, using sieves coupled to a vibratory agitator. The environmental impact thereof consists of sound, vibrations, and dust.
- Secondary washing and drying. Disassembled PCB particles can acquire surface charges during the comminution and sieving processes. This affects the charging efficiency as well as the quality and quantity of products resulting from the overall process [74]. One way to neutralize this parasitic charging is to apply subsequent washing and drying, in order to neutralize the disassembled PCB particles. Hence, the environmental impact is diminished to wastewater and drying energy consumption only.
2.3. Electro-Mechanical Separation Methods
2.3.1. Shredding, Washing, and Sieving
2.3.2. Magnetic Separation
2.3.3. Eddy Current Separators
2.3.4. Corona Electrostatic Separator
- Middling materials of the separation system and additionaltreatment. Due to the feeding process, non-uniform electrical field, and space charge distribution, a considerable number of particles don’t gain sufficient charge and goes in to the middling products. Furthermore, certain unintended factors, such as changes in ambient conditions, often increase the middling products.
- Nonconductive material impurity and additional treatment. Since the particle mixture consists mainly of nonmetals, certain metals are covered with nonmetals. Such particles bind to the sheet, move with it, and eventually goes with the particles that are not conductive. This contributes not only to metal loss, but also to the impurity of the non-conductive materials. If the particle dimensions are <0.6 mm, it is possible to achieve complete separation between metals and non-metals for comminuted PCB waste [101].
- Stability of the separation process. For the following reasons, the results are unstable [102]: The metal concentration variability in the feeding material; the temperature and humidity fluctuations; the electrostatic separation sensitivity to the particle size; and the accumulation of dust on the corona electrode. For example, under laboratory conditions, the granule mixture can be sorted into several size groups. Nevertheless, this is not valid in industrial applications, where particles belonging to different size groups are always a concern.
- Agreement between efficiency of production and quality of separation. Higher feed rates and higher roll speeds are required to increase the production capacity. However, a higher roll speed could lead to poor quality of separation [103] due to the creation of a large quantity of middling products.
- Feeding granule mixture superficial moisture. The mixture of feeding granules absorbs the moisture in the area.
2.3.5. Triboelectrostatic Separation
2.4. Gravity Separation
2.5. Chemical Recycling Techniques
2.6. Electrochemical Processes
2.7. Thermal Recycling Methods
2.7.1. Pyrolysis Process
2.7.2. Thermal Treatment
3. Conclusions
Author Contributions
Funding
Acknowledgments
Conflicts of Interest
References
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Electronic Parts of PCB | Weight/Piece (g) | Ag (g/Kg) | Au (g/Kg) | Pd (g/Kg) | Pt (g/Kg) | Cu (g/Kg) | Al (g/Kg) |
---|---|---|---|---|---|---|---|
Aluminum capacitor | 5.551 | 0 | 0.001 | 0.0001 | 0.001 | 7.4 | 670 |
Tantalum capacitor | 0.27 | 0 | 0.14 | 0 | 0 | 0.22 | 1.3 |
Ceramic capacitor | 0.218 | 0.06 | 0.036 | 0 | 0 | 510 | 0.25 |
Smallest capacitor | 0.006 | 100 | 0.008 | 35 | 5 | 2.4 | 1.3 |
Electronic resistance | 1.625 | 57.602 | 3.601 | 2.509 | 0 | 380.4 | 34.94 |
Plastic IC chip | 9.913 | 12.2 | 15.398 | 0.083 | 0.264 | 901 | 4.879 |
Central processing units (without metal film) | 6.02 | 0.055 | 0.517 | 0.075 | 0 | 500 | 0 |
Integrated Graphics Processor (IGP) | 4.13 | 0.032 | 0.501 | 0.041 | 0 | 171 | 0 |
Integrated Drive Electronics Connector | 0.681 | 0.016 | 0.37 | 0.007 | 0 | 770 | 8.8 |
Small Computer System Interface Connector | 0.882 | 0.002 | 0.7 | 0 | 0.052 | 0.21 | 110 |
Processes | Separation Criteria | Principles of Separation | Sorting Task | Workable Particle Size Range |
---|---|---|---|---|
Shredding, washing, sieving | Shredding: Mechanical forces. Sieving: Vibratory. | Washing: To remove the adhered impurities. Sieving: Using sieves coupled to a vibratory agitator. | Shredding: Crushing and grinding. Washing: Separation the impurities from the useful material. Sieving: Particle size separation. | 3–5 mm |
Magnetic separation | Magnetic field. | The use of magnets to separate magnetic materials from mixtures. | Separation ferromagnetic metals from non-ferrous metals and other non-magnetic waste. | 3–5 mm |
Eddy current separation | Electric conductivity and density. | The use of a powerful magnetic field to separate non-ferrous metals. | Non-ferrous metal/non-metal separation. | >5 mm |
Corona electrostatic separation | Electric conductivity. | Different charges of particles resulting in different forces between particles. | Metal/non-metal separation. | 0.1–5 mm (10 mm for laminar particles) |
Triboelectrostatic separation | Dielectric constant. | Tribo-charge with different charges (+ or −) of the components’ force directions. | Separation of plastics (non-conductors). | <5 (10) mm |
Density Separation Process | Workable Piece Sizes (mm) | Plastics Waste | Aluminum Scrap | Cable Scrap | Electronic Scrap | Light Steel Scrap |
---|---|---|---|---|---|---|
Sink-float separation—Liquids | | | | |||
Sink-float separation—Gravity separator | 5–150 | | | |||
Sink-float separation—Hydrocyclone | <50 | | ||||
Sink-float separation—Aero-chutes | 0.7–3 | | ||||
Sink-float separation—Fluidized bed trough separation | 0.7–5 | | ||||
Sorting by hydraulic jigs | 2–20 | | ||||
Sorting by pneumatic jigs | <3 | | ||||
Sorting in Aero-chutes | 0.6–2 | | ||||
Sorting in Aero-tables | <4 | | ||||
Up-stream hydraulic separation | 5–150 | | | |||
Up-stream pneumatic separation | <300 | |
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Vermeșan, H.; Tiuc, A.-E.; Purcar, M. Advanced Recovery Techniques for Waste Materials from IT and Telecommunication Equipment Printed Circuit Boards. Sustainability 2020, 12, 74. https://doi.org/10.3390/su12010074
Vermeșan H, Tiuc A-E, Purcar M. Advanced Recovery Techniques for Waste Materials from IT and Telecommunication Equipment Printed Circuit Boards. Sustainability. 2020; 12(1):74. https://doi.org/10.3390/su12010074
Chicago/Turabian StyleVermeșan, Horațiu, Ancuța-Elena Tiuc, and Marius Purcar. 2020. "Advanced Recovery Techniques for Waste Materials from IT and Telecommunication Equipment Printed Circuit Boards" Sustainability 12, no. 1: 74. https://doi.org/10.3390/su12010074