Patent Leadership Changes and Technological Competence in Atomic Layer Deposition Technology of Global Leading Companies, Countries, and Subindustries
Abstract
:1. Introduction
- Research question 1 (longitudinal study): how have technological leadership changes in the field of ALD patents progressed among companies, countries, and subindustries over the past 20 years?
- Research question 2 (comparative study): how have the various competencies in the ALD patent portfolio differed by company, country, and subindustry during the past 20 years?
2. Literature Review
3. Data and Methodology
3.1. Patent Data
3.2. Patent Index
3.3. Strategic Matrix Analysis
4. Research Results
4.1. Longitudinal Study—Leadership Change Analysis of ALD Patents
4.1.1. ALD Patents of 40 Leading Companies
4.1.2. ALD Patent Catch-Up Analysis from the Country Perspective
4.1.3. ALD Patent Catch-Up Analysis from the Subindustry Perspective
4.2. Comparative Study—Patent Matrix Analysis of ALD Patents
4.2.1. Entry Time and Growth Competence Matrix Analysis
4.2.2. Quantitative and Impact Competence Matrix Analysis
4.2.3. Technology Specialization and Impact Competence Matrix Analysis
4.2.4. Quantitative and International Competence Matrix Analysis
4.2.5. Impact and International Competence Matrix Analysis
5. Discussion and Conclusions
5.1. Theoretical Implications and Discussions
5.2. Managerial and Policy Implications
5.3. Limitations
Author Contributions
Funding
Institutional Review Board Statement
Informed Consent Statement
Data Availability Statement
Conflicts of Interest
References
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Two-Dimensional Patent Competence Matrix | A Pair of Patent Indicators | Correlation Coefficient |
---|---|---|
Entry Time and Growth Competence Matrix | Entry Time vs. CAGR | 0.656 |
Quantitative and Impact Competence Matrix | Patent Share vs. PII | 0.341 |
Technology Specialization and Impact Competence Matrix | RTA vs. PII | 0.204 |
Quantitative and International Competence Matrix | Patent Share vs. FSS | 0.932 |
Impact and International Competence Matrix | PII vs. FSS | 0.457 |
Year | Total Patents (a) | 40 Leading Companies’ Patent (b) | b/a (%) |
---|---|---|---|
2003 | 95 | 56 | 58.9% |
2004 | 143 | 89 | 62.2% |
2005 | 205 | 158 | 77.1% |
2006 | 302 | 269 | 89.1% |
2007 | 326 | 303 | 92.9% |
2008 | 269 | 219 | 81.4% |
2009 | 261 | 193 | 73.9% |
2010 | 405 | 284 | 70.1% |
2011 | 382 | 236 | 61.8% |
2012 | 429 | 266 | 62.0% |
2013 | 486 | 294 | 60.5% |
2014 | 526 | 314 | 59.7% |
2015 | 560 | 291 | 52.0% |
2016 | 536 | 274 | 51.1% |
2017 | 548 | 266 | 48.5% |
2018 | 530 | 275 | 51.9% |
2019 | 552 | 302 | 54.7% |
2020 | 619 | 370 | 59.8% |
2021 | 662 | 452 | 68.3% |
2022 | 670 | 549 | 81.9% |
Total | 8506 | 5460 | 64.2% |
Rank | Company (Subindustry a) [Country b] | Number of Patents | Entry Year | CAGR of Accumulated Patents | Patents Share | RTA | PII | FSS |
---|---|---|---|---|---|---|---|---|
1 | Samsung (C) [KR] | 720 | 2003 | 25.9% | 13.2% | 0.759 | 0.600 | 11.5% |
2 | TEL (E) [JP] | 622 | 2005 | 40.2% | 11.4% | 3.090 | 1.010 | 15.7% |
3 | SK Hynix (C) [KR] | 604 | 2003 | 16.9% | 11.1% | 1.254 | 0.240 | 6.6% |
4 | AMAT (E) [US] | 403 | 2003 | 32.2% | 7.4% | 2.874 | 3.980 | 10.3% |
5 | TSMC (C) [TW] | 401 | 2003 | 37.1% | 7.3% | 0.956 | 0.970 | 7.3% |
6 | ASM (E) [EU] | 326 | 2004 | 32.7% | 6.0% | 18.343 | 5.120 | 6.8% |
7 | MICRON (C) [US] | 252 | 2004 | 24.3% | 4.6% | 1.621 | 0.970 | 4.4% |
8 | LAM (E) [US] | 227 | 2005 | 32.1% | 4.2% | 5.374 | 1.840 | 6.8% |
9 | IBM (C) [US] | 164 | 2003 | 30.8% | 3.0% | 0.820 | 0.540 | 2.8% |
10 | WONIK (E) [KR] | 147 | 2003 | 25.4% | 2.7% | 9.699 | 0.480 | 1.8% |
11 | Intel (C) [US] | 105 | 2003 | 27.8% | 1.9% | 0.910 | 0.960 | 2.7% |
12 | KOKUSAI (E) [JP] | 101 | 2007 | 36.0% | 1.8% | 2.981 | 0.460 | 2.1% |
13 | INTERMOLECULAR (M) [US] | 99 | 2008 | 38.8% | 1.8% | 3.082 | 3.550 | 1.6% |
14 | KC TECH (E) [KR] | 90 | 2007 | 28.9% | 1.6% | 4.151 | 0.510 | 0.6% |
15 | DB Hitek (C) [KR] | 87 | 2003 | 26.5% | 1.6% | 0.536 | 0.050 | 1.0% |
16 | JUSUNG (E) [KR] | 79 | 2003 | 25.9% | 1.4% | 5.146 | 0.350 | 0.8% |
17 | AIR LIQUID (M) [US] | 73 | 2010 | 43.0% | 1.3% | 15.799 | 0.660 | 2.2% |
18 | SEMICON MANUF (C) [CN] | 71 | 2007 | 32.9% | 1.3% | 0.317 | 0.240 | 0.6% |
19 | G.F. (C) [US] | 63 | 2004 | 25.9% | 1.2% | 0.659 | 0.810 | 1.0% |
20 | TES (E) [KR] | 63 | 2011 | 45.7% | 1.2% | 10.146 | 0.040 | 0.5% |
21 | FUJITSU (C) [JP] | 61 | 2004 | 25.7% | 1.1% | 0.555 | 0.240 | 0.7% |
22 | RENESAS (C) [JP] | 57 | 2004 | 25.2% | 1.0% | 0.268 | 0.460 | 1.1% |
23 | Sony (C) [JP] | 55 | 2006 | 23.0% | 1.0% | 0.367 | 0.380 | 1.2% |
24 | Panasonic (C) [JP] | 53 | 2003 | 13.2% | 1.0% | 0.305 | 0.090 | 1.2% |
25 | BEIJING NMC (E) [CN] | 50 | 2016 | 71.0% | 0.9% | 1.702 | 0.070 | 0.6% |
26 | YMTC (C) [CN] | 48 | 2018 | 86.1% | 0.9% | 1.447 | 0.120 | 0.8% |
27 | Eastman (C) [US] | 45 | 2008 | 31.2% | 0.8% | 5.511 | 1.060 | 0.9% |
28 | UMC (C) [TW] | 44 | 2004 | 23.4% | 0.8% | 0.641 | 0.340 | 0.4% |
29 | NCD (E) [KR] | 39 | 2008 | 29.9% | 0.7% | 38.910 | 0.100 | 0.3% |
30 | SHARP (C) [JP] | 36 | 2003 | 16.4% | 0.7% | 0.272 | 0.590 | 0.6% |
31 | ENTEGRIS (M) [US] | 36 | 2010 | 27.2% | 0.7% | 3.215 | 1.440 | 1.2% |
32 | LG Chem (M) [KR] | 34 | 2010 | 34.2% | 0.6% | 1.001 | 0.090 | 0.7% |
33 | TOPPAN (M) [JP] | 33 | 2014 | 42.0% | 0.6% | 1.043 | 0.150 | 0.8% |
34 | ULVAC (E) [JP] | 32 | 2008 | 30.6% | 0.6% | 1.343 | 0.440 | 0.6% |
35 | LGD (C) [KR] | 29 | 2007 | 27.2% | 0.5% | 0.216 | 0.160 | 0.5% |
36 | Kioxia (C) [JP] | 28 | 2005 | 21.7% | 0.5% | 0.209 | 0.330 | 0.4% |
37 | Resonac (M) [JP] | 24 | 2005 | 20.6% | 0.4% | 0.322 | 0.120 | 0.4% |
38 | Hitachi (E) [JP] | 23 | 2006 | 21.6% | 0.4% | 0.347 | 0.100 | 0.6% |
39 | Canon (E) [JP] | 19 | 2010 | 10.1% | 0.3% | 1.896 | 0.040 | 0.4% |
40 | OSRAM (C) [EU] | 17 | 2014 | 19.8% | 0.3% | 0.539 | 0.150 | 0.6% |
Median (Threshold for the matrix) | 62.0 | 2007 and 2008 | 27.5% | 27.5% | 1.15% | 0.411 | 1.0% | |
Total/Average | Total 5460 | N/A | N/A | N/A | Total 100% | Average 0.746 | Total 100% |
Year | Number of Patents by Country | Number of Patents by Subindustry | Total | |||||||
---|---|---|---|---|---|---|---|---|---|---|
KR | US | JP | EU | TW | CN | Chipmakers | Equipment | Material | ||
2003 | 44 | 4 | 7 | 0 | 1 | 0 | 51 | 5 | 0 | 56 |
2004 | 65 | 12 | 9 | 2 | 1 | 0 | 72 | 17 | 0 | 89 |
2005 | 119 | 19 | 17 | 3 | 0 | 0 | 131 | 26 | 1 | 158 |
2006 | 203 | 26 | 23 | 9 | 8 | 0 | 242 | 27 | 0 | 269 |
2007 | 226 | 32 | 27 | 4 | 13 | 1 | 280 | 21 | 2 | 303 |
2008 | 119 | 47 | 35 | 9 | 7 | 2 | 179 | 39 | 1 | 219 |
2009 | 95 | 35 | 40 | 12 | 5 | 6 | 139 | 54 | 0 | 193 |
2010 | 134 | 58 | 67 | 17 | 4 | 4 | 188 | 92 | 4 | 284 |
2011 | 106 | 41 | 65 | 17 | 6 | 1 | 140 | 89 | 7 | 236 |
2012 | 105 | 49 | 81 | 21 | 3 | 7 | 132 | 122 | 12 | 266 |
2013 | 66 | 76 | 100 | 32 | 18 | 2 | 130 | 146 | 18 | 294 |
2014 | 106 | 57 | 75 | 53 | 19 | 4 | 126 | 147 | 41 | 314 |
2015 | 59 | 69 | 74 | 51 | 29 | 9 | 124 | 123 | 44 | 291 |
2016 | 60 | 66 | 84 | 32 | 22 | 10 | 118 | 131 | 25 | 274 |
2017 | 53 | 57 | 78 | 32 | 41 | 5 | 123 | 117 | 26 | 266 |
2018 | 63 | 74 | 68 | 18 | 38 | 14 | 121 | 137 | 17 | 275 |
2019 | 49 | 89 | 73 | 27 | 51 | 13 | 126 | 143 | 33 | 302 |
2020 | 83 | 96 | 72 | 48 | 55 | 16 | 151 | 191 | 28 | 370 |
2021 | 61 | 172 | 82 | 46 | 59 | 32 | 178 | 250 | 24 | 452 |
2022 | 76 | 216 | 67 | 82 | 65 | 43 | 189 | 344 | 16 | 549 |
Total | 1892 | 1295 | 1144 | 515 | 445 | 169 | 2940 | 2221 | 299 | 5460 |
CAGR | 21.9% | 35.6% | 30.8% | 36.1% | 40.3% | 40.8% | 23.8% | 37.8% | 35.0% | 27.3% |
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Lee, S.; Lee, H. Patent Leadership Changes and Technological Competence in Atomic Layer Deposition Technology of Global Leading Companies, Countries, and Subindustries. Sustainability 2025, 17, 2600. https://doi.org/10.3390/su17062600
Lee S, Lee H. Patent Leadership Changes and Technological Competence in Atomic Layer Deposition Technology of Global Leading Companies, Countries, and Subindustries. Sustainability. 2025; 17(6):2600. https://doi.org/10.3390/su17062600
Chicago/Turabian StyleLee, Seunghwan, and Heesang Lee. 2025. "Patent Leadership Changes and Technological Competence in Atomic Layer Deposition Technology of Global Leading Companies, Countries, and Subindustries" Sustainability 17, no. 6: 2600. https://doi.org/10.3390/su17062600
APA StyleLee, S., & Lee, H. (2025). Patent Leadership Changes and Technological Competence in Atomic Layer Deposition Technology of Global Leading Companies, Countries, and Subindustries. Sustainability, 17(6), 2600. https://doi.org/10.3390/su17062600