A Thermal Actuated Bistable Structure for Generating On-Chip Shock Loads
Abstract
:1. Introduction
2. Principle and Design
2.1. Bistable Shock Structure
2.2. Shock Tester
3. Fabrication
4. Experimental Results
5. Conclusions
Author Contributions
Funding
Informed Consent Statement
Acknowledgments
Conflicts of Interest
References
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Parameter | Value |
---|---|
Young modulus (E) | 169 GPa [31] |
Poisson ratio | 0.28 [31] |
Density | 2330 kg/m3 |
Thermal expansion | 2.6 × 10−6 [32] |
Thermal conductivity | 150 W m−1 K−1 [33] |
Resistivity | 0.002 Ω cm |
Specific heat | 730 J kg−1 K−1 [34] |
Convective heat transfer coefficient | 100 W m−2 K−1 [28] |
Dimension | Value |
---|---|
Length of bistable beam | 1000 μm |
Width of bistable beam | 20 μm |
Length of thermal beam | 1000 μm |
Width of thermal beam | 10 μm |
Angle of thermal beam | 6° |
Number of thermal beams | 20 |
Thickness of structure | 60 μm |
Part | Dimension | Value |
---|---|---|
Thermal actuator at both ends of the bistable beam | Length Width | 200 μm 10 μm |
Angle | 6° | |
Number | 10 | |
V-shaped lever | Length Width | 1150 μm 40 μm |
Angle | 4° |
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Yu, R.; Zhang, D. A Thermal Actuated Bistable Structure for Generating On-Chip Shock Loads. Micromachines 2022, 13, 569. https://doi.org/10.3390/mi13040569
Yu R, Zhang D. A Thermal Actuated Bistable Structure for Generating On-Chip Shock Loads. Micromachines. 2022; 13(4):569. https://doi.org/10.3390/mi13040569
Chicago/Turabian StyleYu, Runze, and Dacheng Zhang. 2022. "A Thermal Actuated Bistable Structure for Generating On-Chip Shock Loads" Micromachines 13, no. 4: 569. https://doi.org/10.3390/mi13040569