MDPI and ACS Style
Liu, J.; Xia, S.; Peng, C.; Wu, Z.; Chu, Z.; Zhang, Z.; Lei, H.; Zheng, F.; Zhang, W.
Wafer-Level Vacuum-Packaged Electric Field Microsensor: Structure Design, Theoretical Model, Microfabrication, and Characterization. Micromachines 2022, 13, 928.
https://doi.org/10.3390/mi13060928
AMA Style
Liu J, Xia S, Peng C, Wu Z, Chu Z, Zhang Z, Lei H, Zheng F, Zhang W.
Wafer-Level Vacuum-Packaged Electric Field Microsensor: Structure Design, Theoretical Model, Microfabrication, and Characterization. Micromachines. 2022; 13(6):928.
https://doi.org/10.3390/mi13060928
Chicago/Turabian Style
Liu, Jun, Shanhong Xia, Chunrong Peng, Zhengwei Wu, Zhaozhi Chu, Zhouwei Zhang, Hucheng Lei, Fengjie Zheng, and Wei Zhang.
2022. "Wafer-Level Vacuum-Packaged Electric Field Microsensor: Structure Design, Theoretical Model, Microfabrication, and Characterization" Micromachines 13, no. 6: 928.
https://doi.org/10.3390/mi13060928