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Journal: Micromachines, 2022
Volume: 13
Number: 1072
Article:
Implementation of Flip-Chip Microbump Bonding between InP and SiC Substrates for Millimeter-Wave Applications
Authors:
by
Jongwon Lee, Jae Yong Lee, Jonghyun Song, Gapseop Sim, Hyoungho Ko and Seong Ho Kong
Link:
https://www.mdpi.com/2072-666X/13/7/1072
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