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Journal: Micromachines, 2022
Volume: 13
Number: 1537

Article: Height Uniformity Simulation and Experimental Study of Electroplating Gold Bump for 2.5D/3D Integrated Packaging
Authors: by Wenchao Tian, Zhao Li, Yongkun Wang and Guoguang Zhang
Link: https://www.mdpi.com/2072-666X/13/9/1537

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