Yu, W.; Che, F.; Liu, V.; Chen, R.; Ireland, S.; Ong, Y.C.; Ng, H.W.; Kumar, G.
An Overview of Substrate Copper Trace Crack Through Experiments, Characterization, and Numerical Simulations. Micromachines 2025, 16, 428.
https://doi.org/10.3390/mi16040428
AMA Style
Yu W, Che F, Liu V, Chen R, Ireland S, Ong YC, Ng HW, Kumar G.
An Overview of Substrate Copper Trace Crack Through Experiments, Characterization, and Numerical Simulations. Micromachines. 2025; 16(4):428.
https://doi.org/10.3390/mi16040428
Chicago/Turabian Style
Yu, Wei, Faxing Che, Vance Liu, Raymond Chen, Sam Ireland, Yeow Chon Ong, Hong Wan Ng, and Gokul Kumar.
2025. "An Overview of Substrate Copper Trace Crack Through Experiments, Characterization, and Numerical Simulations" Micromachines 16, no. 4: 428.
https://doi.org/10.3390/mi16040428
APA Style
Yu, W., Che, F., Liu, V., Chen, R., Ireland, S., Ong, Y. C., Ng, H. W., & Kumar, G.
(2025). An Overview of Substrate Copper Trace Crack Through Experiments, Characterization, and Numerical Simulations. Micromachines, 16(4), 428.
https://doi.org/10.3390/mi16040428
