Li, X.; Pan, Z.; Hao, W.; Miao, R.; Yue, Z.; Wang, A.
Interposer-Based ESD Protection: A Potential Solution for μ-Packaging Reliability of 3D Chips. Micromachines 2025, 16, 488.
https://doi.org/10.3390/mi16040488
AMA Style
Li X, Pan Z, Hao W, Miao R, Yue Z, Wang A.
Interposer-Based ESD Protection: A Potential Solution for μ-Packaging Reliability of 3D Chips. Micromachines. 2025; 16(4):488.
https://doi.org/10.3390/mi16040488
Chicago/Turabian Style
Li, Xunyu, Zijin Pan, Weiquan Hao, Runyu Miao, Zijian Yue, and Albert Wang.
2025. "Interposer-Based ESD Protection: A Potential Solution for μ-Packaging Reliability of 3D Chips" Micromachines 16, no. 4: 488.
https://doi.org/10.3390/mi16040488
APA Style
Li, X., Pan, Z., Hao, W., Miao, R., Yue, Z., & Wang, A.
(2025). Interposer-Based ESD Protection: A Potential Solution for μ-Packaging Reliability of 3D Chips. Micromachines, 16(4), 488.
https://doi.org/10.3390/mi16040488