Article Versions Notes

Liang H, Chen W, Fu Y, Zhou W, Mo L, Wen Q, Liu D, He J. Multi-Field Characterisation of Material Removal Processes in Ultrasonic Magnetorheological Chemical Compound Polishing of GaN Wafers. Micromachines. 2025; 16(5):502. https://doi.org/10.3390/mi16050502

Liang, Huazhuo, Wenjie Chen, Youzhi Fu, Wenjie Zhou, Ling Mo, Qi Wen, Dawei Liu, and Junfeng He. 2025. "Multi-Field Characterisation of Material Removal Processes in Ultrasonic Magnetorheological Chemical Compound Polishing of GaN Wafers" Micromachines 16, no. 5: 502. https://doi.org/10.3390/mi16050502

Liang, H., Chen, W., Fu, Y., Zhou, W., Mo, L., Wen, Q., Liu, D., & He, J. (2025). Multi-Field Characterisation of Material Removal Processes in Ultrasonic Magnetorheological Chemical Compound Polishing of GaN Wafers. Micromachines, 16(5), 502. https://doi.org/10.3390/mi16050502